Issued Patents All Time
Showing 351–375 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074618 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen | 2018-09-11 |
| 10074629 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2018-09-11 |
| 10049965 | Through-substrate vias and methods for forming the same | Yu-Young Wang, Sen-Bor Jan | 2018-08-14 |
| 10026716 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Sung-Feng Yeh | 2018-07-17 |
| 10014271 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Sung-Feng Yeh | 2018-07-03 |
| 9978708 | Wafer backside interconnect structure connected to TSVs | Wen-Chih Chiou, Shau-Lin Shue | 2018-05-22 |
| 9899355 | Three-dimensional integrated circuit structure | Ching-Pin Yuan, Chen-Hua Yu, Sung-Feng Yeh | 2018-02-20 |
| 9893028 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Yi-Hsiu Chen | 2018-02-13 |
| 9875982 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Ching-Pin Yuan, Sung-Feng Yeh | 2018-01-23 |
| 9873910 | Method of using two-stage nucleic acid reaction and detection tube | Jr Winston Wong, Stephen Chang-Chi Kao, Ying-Ta Lai | 2018-01-23 |
| 9859254 | Semiconductor structure and a manufacturing method thereof | Chen-Hua Yu, Sung-Feng Yeh | 2018-01-02 |
| 9816136 | Two-stage nucleic acid reaction and detection tube | Jr Winston Wong, Stephen Chang-Chi Kao, Ying-Ta Lai | 2017-11-14 |
| 9806055 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Sung-Feng Yeh | 2017-10-31 |
| 9786540 | Method of manufacturing a semiconductor device | Yung-Jean Lu, Chen-Shien Chen, Jao Sheng Huang | 2017-10-10 |
| 9773755 | Substrate interconnections having different sizes | Wen-Wei Shen, Ying-Ching Shih, Chen-Shien Chen | 2017-09-26 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Rung-De Wang | 2017-09-19 |
| 9754918 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Wen-Ching Tsai, Sung-Feng Yeh | 2017-09-05 |
| 9741694 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Sung-Feng Yeh | 2017-08-22 |
| 9716074 | Wafer backside interconnect structure connected to TSVs | Wen-Chih Chiou, Shau-Lin Shue | 2017-07-25 |
| 9711379 | 3D stacked-chip package | Chen-Hua Yu, Wen-Ching Tsai | 2017-07-18 |
| 9698081 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Wen-Ching Tsai | 2017-07-04 |
| 9666520 | 3D stacked-chip package | Chen-Hua Yu, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai | 2017-05-30 |
| 9633917 | Three dimensional integrated circuit structure and method of manufacturing the same | Wen-Ching Tsai, Chen-Hua Yu | 2017-04-25 |
| 9620488 | Three-dimensional integrated circuit structure and bonded structure | Chen-Hua Yu, Sung-Feng Yeh | 2017-04-11 |
| 9613926 | Wafer to wafer bonding process and structures | Chen-Hua Yu, Wen-Ching Tsai | 2017-04-04 |