Issued Patents All Time
Showing 301–325 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707149 | Through-silicon via with low-K dielectric liner | — | 2020-07-07 |
| 10685911 | Semiconductor package and manufacturing method of the same | Sung-Feng Yeh, Chen-Hua Yu | 2020-06-16 |
| 10685935 | Forming metal bonds with recesses | Hsien-Wei Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-06-16 |
| 10685937 | Integrated circuit package having dummy structures and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2020-06-16 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen | 2020-06-16 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Hsien-Wei Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2020-06-02 |
| 10665582 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Wen-Chih Chiou | 2020-05-26 |
| 10658333 | Package structure and method of fabricating the same | Hsien-Wei Chen, Sung-Feng Yeh | 2020-05-19 |
| 10651149 | Packages formed using RDL—last process | Chen-Hua Yu | 2020-05-12 |
| 10622327 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Sung-Feng Yeh | 2020-04-14 |
| 10541227 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2020-01-21 |
| 10541228 | Packages formed using RDL-last process | Chen-Hua Yu | 2020-01-21 |
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Chen-Hua Yu, Wen-Ching Tsai, Sung-Feng Yeh | 2020-01-14 |
| 10535636 | Integrating passive devices in package structures | Chih-Chia Hu | 2020-01-14 |
| 10522382 | Method of manufacturing a semiconductor device | Yung-Jean Lu, Chen-Shien Chen, Jao Sheng Huang | 2019-12-31 |
| 10522449 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2019-12-31 |
| 10515874 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2019-12-24 |
| 10510699 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Yi-Hsiu Chen | 2019-12-17 |
| 10510691 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Hsien-Wei Chen | 2019-12-17 |
| 10510676 | System and method for aligned stitching | Chih-Chia Hu, Chang-Ching Yu | 2019-12-17 |
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510436 | Using serial dilutions of reference samples to construct a reference table for sigmoidal fitting in real-time PCR copy number analysis | Jr. Winston Wong, Stephen Chang-Chi Kao, Ying-Ta Lai, Yih-Jyh Shann, Chih-Rong Chen | 2019-12-17 |
| 10510629 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2019-12-17 |
| 10510718 | Semiconductor structure and manufacturing method thereof | Wen-Chih Chiou, Sung-Feng Yeh | 2019-12-17 |