Issued Patents All Time
Showing 276–300 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923421 | Package structure and method of manufacturing the same | Ying-Ju Chen, Hsien-Wei Chen | 2021-02-16 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2021-01-05 |
| 10872836 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2020-12-22 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867884 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Tsung-Yu Chen | 2020-12-15 |
| 10867885 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Tsung-Yu Chen | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2020-12-15 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Hsien-Wei Chen, Sung-Feng Yeh, Chao-Wen Shih | 2020-12-15 |
| 10867968 | 3DIC structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ching-Jung Yang | 2020-12-15 |
| 10861808 | Bonding structure of dies with dangling bonds | Hsien-Wei Chen, Chih-Chia Hu | 2020-12-08 |
| 10854568 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2020-12-01 |
| 10854574 | Forming metal bonds with recesses | Hsien-Wei Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-12-01 |
| 10840217 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Sung-Feng Yeh | 2020-11-17 |
| 10840190 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Hsien-Wei Chen | 2020-11-17 |
| 10818624 | Semiconductor structure and method for manufacturing the same | Hsien-Wei Chen | 2020-10-27 |
| 10818615 | Semiconductor structure | Ying-Ju Chen, Hsien-Wei Chen | 2020-10-27 |
| 10811390 | Die stack structure and method of fabricating the same and package | Jie Chen, Hsien-Wei Chen | 2020-10-20 |
| 10797015 | Method of manufacturing 3DIC structure | Sung-Feng Yeh, Hsien-Wei Chen | 2020-10-06 |
| 10784247 | Process control for package formation | Hsien-Wei Chen | 2020-09-22 |
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan | 2020-09-22 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10748841 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2020-08-18 |
| 10741506 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Hsien-Wei Chen | 2020-08-11 |
| 10727217 | Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together | Chen-Hua Yu | 2020-07-28 |
| 10727201 | Packages formed using RDL-last process | Chen-Hua Yu | 2020-07-28 |