Issued Patents All Time
Showing 226–250 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309243 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2022-04-19 |
| 11309289 | Integrated circuit package having heat dissipation structure | Hsien-Wei Chen, Chen-Hua Yu | 2022-04-19 |
| 11289450 | Semiconductor structure and manufacturing method thereof | Wen-Chih Chiou, Sung-Feng Yeh | 2022-03-29 |
| 11282784 | Semiconductor package and manufacturing method of the same | Sung-Feng Yeh, Chen-Hua Yu | 2022-03-22 |
| 11264362 | Semiconductor structure and method of fabricating the same | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Sung-Feng Yeh, Hsien-Wei Chen, Jie Chen | 2022-03-01 |
| 11257791 | Stacked die structure and method of fabricating the same | Jie Chen, Hsien-Wei Chen | 2022-02-22 |
| 11257787 | Package structure and method of fabricating the same | Hsien-Wei Chen, Sung-Feng Yeh | 2022-02-22 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Jie Chen | 2022-02-15 |
| 11239205 | Integrating passive devices in package structures | Chih-Chia Hu | 2022-02-01 |
| 11239225 | Three-dimensional integrated circuit structures and methods of manufacturing the same | Hsien-Wei Chen, Sung-Feng Yeh | 2022-02-01 |
| 11233035 | Package structure and method of manufacturing the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2022-01-25 |
| 11227812 | Package and manufacturing method thereof | Sung-Feng Yeh, Jian-Wei Hong | 2022-01-18 |
| 11195810 | Bonding structure and method of forming same | Hsien-Wei Chen, Jie Chen | 2021-12-07 |
| 11195804 | Semiconductor structure | Ying-Ju Chen, Hsien-Wei Chen | 2021-12-07 |
| 11189599 | System formed through package-in-package formation | Chen-Hua Yu, Sung-Feng Yeh | 2021-11-30 |
| 11183454 | Functional component within interconnect structure of semiconductor device and method of forming same | Hsien-Wei Chen | 2021-11-23 |
| 11164848 | Semiconductor structure and method manufacturing the same | Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Jie Chen | 2021-09-14 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-09-07 |
| 11114433 | 3DIC structure and method of fabricating the same | Hsien-Wei Chen | 2021-09-07 |
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Sen-Bor Jan, Chih-Chia Hu | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Chih-Chia Hu, Hsien-Wei Chen, Sen-Bor Jan | 2021-08-17 |
| 11088131 | Semiconductor device that uses bonding layer to join semiconductor substrates together | Chen-Hua Yu | 2021-08-10 |
| 11088041 | Semiconductor packages with shortened talking path | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2021-08-10 |