Issued Patents All Time
Showing 176–200 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587922 | Process control for package formation | Hsien-Wei Chen | 2023-02-21 |
| 11587907 | Package structure | Tzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang | 2023-02-21 |
| 11587894 | Package and method of fabricating the same | Chao-Wen Shih, Tzuan-Horng Liu, Jen-Li Hu | 2023-02-21 |
| 11574878 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Hsien-Wei Chen | 2023-02-07 |
| 11574847 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2023-02-07 |
| 11562983 | Package having multiple chips integrated therein and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-24 |
| 11562982 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Sung-Feng Yeh | 2023-01-24 |
| 11562935 | Semiconductor structure | Hsien-Wei Chen, Ching-Jung Yang | 2023-01-24 |
| 11557581 | Package structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen | 2023-01-17 |
| 11552074 | Package structures and methods of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-10 |
| 11532598 | Package structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ching-Jung Yang | 2022-12-20 |
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen | 2022-12-13 |
| 11502062 | Integrated circuit package and method | Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2022-11-15 |
| 11495559 | Integrated circuits | Hsien-Wei Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-11-08 |
| 11482649 | Semiconductor package and manufacturing method of semiconductor package | Hsien-Wei Chen, Jie Chen | 2022-10-25 |
| 11482499 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Hsien-Wei Chen | 2022-10-25 |
| 11476201 | Package-on-package device | Sung-Feng Yeh, Hsien-Wei Chen | 2022-10-18 |
| 11469166 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2022-10-11 |
| 11462458 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2022-10-04 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-27 |
| 11450579 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen | 2022-09-20 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-13 |
| 11424191 | Semiconductor devices and methods of manufacture | Hsien-Wei Chen | 2022-08-23 |
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2022-08-16 |
| 11417619 | Package and manufacturing method thereof | Hsien-Wei Chen, Sung-Feng Yeh | 2022-08-16 |