Issued Patents All Time
Showing 201–225 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417619 | Package and manufacturing method thereof | Hsien-Wei Chen, Sung-Feng Yeh | 2022-08-16 |
| 11410929 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Chin-Chou Liu +1 more | 2022-08-09 |
| 11410948 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2022-08-09 |
| 11404404 | Semiconductor structure having photonic die and electronic die | Hsien-Wei Chen | 2022-08-02 |
| 11387209 | Package structure | Sung-Feng Yeh, Hsien-Wei Chen | 2022-07-12 |
| 11387205 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2022-07-12 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-07-05 |
| 11380598 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2022-07-05 |
| 11373981 | Package and manufacturing method thereof | Sung-Feng Yeh, Jian-Wei Hong | 2022-06-28 |
| 11373953 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Hsien-Wei Chen | 2022-06-28 |
| 11372160 | Package, optical device, and manufacturing method of package | Hsien-Wei Chen | 2022-06-28 |
| 11366015 | Microelectromechanical infrared sensing device | Bor-Shiun Lee | 2022-06-21 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ching-Jung Yang, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11359970 | Microelectromechanical infrared sensing apparatus having stoppers | Bor-Shiun Lee, Ying-Che Lo, Chao-Ta Huang | 2022-06-14 |
| 11362013 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2022-06-14 |
| 11362065 | Package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2022-06-14 |
| 11362066 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen | 2022-06-14 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2022-06-14 |
| 11347001 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen | 2022-05-31 |
| 11342297 | Package structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan, Sung-Feng Yeh | 2022-05-24 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan | 2022-05-17 |
| 11322477 | Package structure and method of fabricating the same | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2022-05-03 |
| 11315855 | Package structure with photonic die and method | Hsien-Wei Chen, Ying-Ju Chen | 2022-04-26 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-04-19 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |