Issued Patents All Time
Showing 151–175 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728312 | Semiconductor packaging and methods of forming same | Hsien-Wei Chen | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2023-08-15 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Sen-Bor Jan | 2023-08-15 |
| 11721663 | Multi-level stacking of wafers and chips | Cheng-Feng Chen, Sung-Feng Yeh, Chuan-An Cheng | 2023-08-08 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2023-08-01 |
| 11715723 | Wafer on wafer bonding structure | Chao-Wen Shih, Sung-Feng Yeh | 2023-08-01 |
| 11705423 | Package structure | Sung-Feng Yeh, Hsien-Wei Chen | 2023-07-18 |
| 11705343 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ying-Ju Chen | 2023-07-18 |
| 11699694 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Wen-Chih Chiou | 2023-07-11 |
| 11699663 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ying-Ju Chen | 2023-07-11 |
| 11699638 | Package and manufacturing method thereof | Sung-Feng Yeh, Jian-Wei Hong | 2023-07-11 |
| 11676942 | Semiconductor structure and method of manufacturing the same | Hsien-Wei Chen, Sung-Feng Yeh | 2023-06-13 |
| 11676908 | System and method for aligned stitching | Chih-Chia Hu, Chang-Ching Yu | 2023-06-13 |
| 11670621 | Die stack structure | Jie Chen, Hsien-Wei Chen | 2023-06-06 |
| 11670617 | Packages formed using RDL-last process | Chen-Hua Yu | 2023-06-06 |
| 11664349 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Sung-Feng Yeh | 2023-05-30 |
| 11664336 | Bonding structure and method of forming same | Hsien-Wei Chen, Jie Chen | 2023-05-30 |
| 11658150 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2023-05-23 |
| 11658069 | Method for manufacturing a semiconductor device having an interconnect structure over a substrate | Tzuan-Horng Liu, Chao-Wen Shih | 2023-05-23 |
| 11656128 | Microelectromechanical infrared sensing device and fabrication method thereof | Chin-Jou Kuo, Bor-Shiun Lee | 2023-05-23 |
| 11621214 | Semiconductor package and method for manufacturing the same | Hsien-Wei Chen, Jie Chen | 2023-04-04 |
| 11610858 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2023-03-21 |
| 11609391 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2023-03-21 |
| 11600551 | Through-silicon via with low-K dielectric liner | — | 2023-03-07 |