Issued Patents All Time
Showing 101–125 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923302 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Chin-Chou Liu +1 more | 2024-03-05 |
| 11916031 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan | 2024-02-27 |
| 11916012 | Manufacturing method of semiconductor structure | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-02-27 |
| 11908836 | Semiconductor package and method of manufacturing semiconductor package | Hsien-Wei Chen | 2024-02-20 |
| 11908817 | Bonding structure of dies with dangling bonds | Hsien-Wei Chen, Chih-Chia Hu | 2024-02-20 |
| 11899242 | Method of manufacturing a packaged device with optical pathway | Hsien-Wei Chen | 2024-02-13 |
| 11894309 | System on integrated chips (SoIC) and semiconductor structures with integrated SoIC | Chen-Hua Yu, Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh | 2024-02-06 |
| 11869819 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen | 2024-01-09 |
| 11862590 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ying-Ju Chen | 2024-01-02 |
| 11862599 | Bonding to alignment marks with dummy alignment marks | Hsien-Wei Chen, Ying-Ju Chen | 2024-01-02 |
| 11862605 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2024-01-02 |
| 11855063 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Chen-Hua Yu | 2023-12-26 |
| 11856800 | Semiconductor devices with system on chip devices | Chen-Hua Yu, Hsien-Wei Chen, Wen-Chih Chiou, Sung-Feng Yeh | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11854967 | Semiconductor packages | Jie Chen, Hsien-Wei Chen | 2023-12-26 |
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11854785 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2023-12-26 |
| 11855029 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2023-12-26 |
| 11855042 | Method of manufacturing semiconductor structure | Wen-Chih Chiou, Sung-Feng Yeh | 2023-12-26 |
| 11848246 | Integrated circuit package and method | Hsien-Wei Chen, Sung-Feng Yeh | 2023-12-19 |
| 11848267 | Functional component within interconnect structure of semiconductor device and method of forming same | Hsien-Wei Chen | 2023-12-19 |
| 11846802 | Semiconductor structure | Hsien-Wei Chen | 2023-12-19 |
| 11837578 | Package structure | Hsien-Wei Chen, Sung-Feng Yeh | 2023-12-05 |
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Jie Chen, Ching-Jung Yang | 2023-12-05 |