Issued Patents All Time
Showing 126–150 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823989 | Multi-liner TSV structure and method forming same | Chin-Shyh Wang, Chao-Wen Shih | 2023-11-21 |
| 11820650 | Microelectromechanical apparatus having hermitic chamber | Bor-Shiun Lee, Yu-Wen Hsu, Chao-Ta Huang | 2023-11-21 |
| 11817426 | Package and method of fabricating the same | Hsien-Wei Chen | 2023-11-14 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Hsien-Wei Chen | 2023-11-14 |
| 11810899 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Sung-Feng Yeh | 2023-11-07 |
| 11810897 | Package structure and method of fabricating the same | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-11-07 |
| 11810883 | Package structure | Hsien-Wei Chen | 2023-11-07 |
| 11798931 | Semiconductor package | Jie Chen, Hsien-Wei Chen | 2023-10-24 |
| 11791246 | Package structure with photonic die and method | Hsien-Wei Chen, Ying-Ju Chen | 2023-10-17 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2023-10-17 |
| 11789201 | Package, optical device, and manufacturing method of package | Hsien-Wei Chen | 2023-10-17 |
| 11784163 | Stacking structure, package structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-10-10 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Jie Chen | 2023-09-26 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2023-09-26 |
| 11769718 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2023-09-26 |
| 11756933 | Inactive structure on SoIC | Sung-Feng Yeh, Hsien-Wei Chen | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Sung-Feng Yeh, Hsien-Wei Chen, Jie Chen | 2023-09-12 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Hsien-Wei Chen | 2023-09-12 |
| 11749729 | Semiconductor device, integrated circuit component and manufacturing methods thereof | — | 2023-09-05 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Sen-Bor Jan, Meng-Wei Chiang | 2023-09-05 |
| 11742297 | Semiconductor packages | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-08-29 |
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Hsien-Wei Chen, Sung-Feng Yeh, Jie Chen | 2023-08-22 |
| 11735536 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Sen-Bor Jan, Chih-Chia Hu | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen, Ying-Ju Chen | 2023-08-22 |
| 11728324 | Semiconductor structure having photonic die and electronic die | Hsien-Wei Chen | 2023-08-15 |