Issued Patents All Time
Showing 151–175 of 191 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Ming-Kai Liu, Ching-Feng Yang | 2016-08-09 |
| 9397060 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen | 2016-07-19 |
| 9391012 | Methods and apparatus for package with interposers | Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2016-07-12 |
| 9373599 | Methods and apparatus for package on package devices | Ming-Kai Liu, Hsien-Wei Chen, Shih-Wei Liang | 2016-06-21 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9355982 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2016-05-31 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Han-Ping Pu, Chun-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng | 2016-05-31 |
| 9331023 | Device packaging | Ming-Kai Liu, Yu-Peng Tsai, Wei-Hung Lin, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-03 |
| 9263405 | Semiconductor device | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang | 2016-02-16 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Hsien-Wei Chen, Chung-Ying Yang, Chao-Wen Shih | 2016-01-12 |
| 9209140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Chun-Lin Lu, Hung-Jui Kuo | 2015-12-08 |
| 9184143 | Semiconductor device with bump adjustment and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang | 2015-11-10 |
| 9165875 | Low profile interposer with stud structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai | 2015-10-20 |
| 9159686 | Crack stopper on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Ming-Che Ho | 2015-10-13 |
| 9123601 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen | 2015-09-01 |
| 9082870 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Hung-Jui Kuo | 2015-07-14 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2015-07-14 |
| 9064873 | Singulated semiconductor structure | Chia-Chun Miao, Shih-Wei Liang, Ming-Kai Liu, Yen-Ping Wang | 2015-06-23 |
| 9030010 | Packaging devices and methods | Shih-Wei Liang, Ming-Che Ho, Yi-Wen Wu | 2015-05-12 |
| 8994176 | Methods and apparatus for package with interposers | Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2015-03-31 |
| 8962279 | Solid-phase chelators and electronic biosensors | David J. Liu, Xing Su | 2015-02-24 |
| 8916956 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Jui-Pin Hung, Chien-Hsun Lee | 2014-12-23 |
| 8901730 | Methods and apparatus for package on package devices | Ming-Kai Liu, Shih-Wei Liang, Hsien-Wei Chen | 2014-12-02 |
| 8795523 | Device and method for particle complex handling | Xing Su, David J. Liu, Kenneth B. Swartz, Mineo Yamakawa | 2014-08-05 |
| 8749043 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen | 2014-06-10 |