Issued Patents All Time
Showing 176–191 of 191 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8715932 | Nucleic acid sequencing | Xing Su, Liming Wang, Jianquan Liu, Grace Credo | 2014-05-06 |
| 8703539 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Jui-Pin Hung, Chien-Hsiun Lee | 2014-04-22 |
| 8674086 | Nucleotides and oligonucleotides for nucleic acid sequencing | Jianquan Liu, Xing Su | 2014-03-18 |
| 8664768 | Interposer having a defined through via pattern | Shih-Wei Liang, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2014-03-04 |
| 8664008 | Enzymatic signal generation and detection of binding complexes in stationary fluidic chip | David J. Liu, Xing Su | 2014-03-04 |
| 8586385 | Method and device for biomolecule preparation and detection using magnetic array | Xing Su, David J. Liu | 2013-11-19 |
| 8563240 | Nucleic acid sequencing and electronic detection | Xing Su, David J. Liu | 2013-10-22 |
| 8409877 | Enzymatic signal generation and detection of binding complexes in stationary fluidic chip | David J. Liu, Xing Su | 2013-04-02 |
| 8158008 | Device and method for particle complex handling | Xing Su, David J. Liu, Kenneth B. Swartz, Mineo Yamakawa | 2012-04-17 |
| 7993525 | Device and method for particle complex handling | Xing Su, David J. Liu, Kenneth B. Swartz, Mineo Yamakawa | 2011-08-09 |
| 7098524 | Electroplated wire layout for package sawing | Shaw-Wei Chen | 2006-08-29 |
| 7095091 | Packaging stacked chips with finger structure | Shaw-Wei Chen | 2006-08-22 |
| 7091590 | Multiple stacked-chip packaging structure | Wan-Hua Wu | 2006-08-15 |
| 6937477 | Structure of gold fingers | — | 2005-08-30 |
| 6633086 | Stacked chip scale package structure | Yi-Liang Peng | 2003-10-14 |
| 6570263 | Structure of plated wire of fiducial marks for die-dicing package | Yi-Liang Peng, Ya-Yun Cheng | 2003-05-27 |