SC

Shaw-Wei Chen

GL Global Advanced Packaging Technology H.K. Limited: 2 patents #2 of 6Top 35%
Overall (All Time): #2,172,234 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7098524 Electroplated wire layout for package sawing Kai-Chiang Wu 2006-08-29
7095091 Packaging stacked chips with finger structure Kai-Chiang Wu 2006-08-22