Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390103 | Information searching method and system based on geographic location | — | 2016-07-12 |
| 6633086 | Stacked chip scale package structure | Kai-Chiang Wu | 2003-10-14 |
| 6570263 | Structure of plated wire of fiducial marks for die-dicing package | Kai-Chiang Wu, Ya-Yun Cheng | 2003-05-27 |
| 6215180 | Dual-sided heat dissipating structure for integrated circuit package | Tsung-Chieh Chen, Ken Hsu, Cheng-Chieh Hsu | 2001-04-10 |
| 6160311 | Enhanced heat dissipating chip scale package method and devices | Tsung-Chieh Chen | 2000-12-12 |
| 6130477 | Thin enhanced TAB BGA package having improved heat dissipation | Tsung-Chieh Chen, Ken Hsu, Cheng-Chieh Hsu | 2000-10-10 |