Issued Patents All Time
Showing 126–150 of 191 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9900739 | Method and apparatus for identifying a target geographic area | Donghui Zhao, Guojun TONG | 2018-02-20 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-01-23 |
| 9875913 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Yen-Ping Wang | 2018-01-23 |
| 9863857 | Device and method for particle complex handling | Xing Su, David J. Liu, Kenneth B. Swartz, Mineo Yamakawa | 2018-01-09 |
| 9818722 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Chieh-Yen Chen, Yen-Ping Wang, Shou-Zen Chang | 2017-11-14 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9698079 | Barrier structures between external electrical connectors | Chia-Chun Miao, Shih-Wei Liang | 2017-07-04 |
| 9671558 | Chemically induced optical signals and DNA sequencing | Xing Su, Liming Wang, Jianquan Liu | 2017-06-06 |
| 9661794 | Method of manufacturing package structure | Shou-Zen Chang, Chen-Hua Yu, Chung-Shi Liu, Wei-Ting Lin | 2017-05-23 |
| 9659879 | Semiconductor device having a guard ring | Ching-Feng Yang, Chun-Lin Lu, Vincent Chen | 2017-05-23 |
| 9653417 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Ming-Kai Liu | 2017-05-16 |
| 9653418 | Packaging devices and methods | Shih-Wei Liang, Ming-Che Ho, Yi-Wen Wu | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9601439 | Semiconductor structure and manufacturing method thereof | Tzu-Chun Tang, Shou-Zen Chang, Wei-Ting Chen, In-Tsang Lin, Vincent Chen +2 more | 2017-03-21 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Chun-Lin Lu, Hung-Jui Kuo | 2017-02-21 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2017-01-10 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2017-01-10 |
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2016-11-15 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Hung-Jui Kuo | 2016-10-25 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Ming-Che Ho | 2016-10-18 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Ming-Kai Liu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng | 2016-08-16 |