Issued Patents All Time
Showing 126–137 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785299 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Chin-Chuan Chang, Jing-Cheng Lin | 2014-07-22 |
| 8779599 | Packages including active dies and dummy dies and methods for forming the same | Jing-Cheng Lin, Cheng-Lin Huang, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2014-07-15 |
| 8772929 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2014-07-08 |
| 8703542 | Wafer-level packaging mechanisms | Jing-Cheng Lin | 2014-04-22 |
| 8703539 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Chien-Hsiun Lee, Kai-Chiang Wu | 2014-04-22 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao, Kung-Chen Yeh +7 more | 2014-01-14 |
| 8507940 | Heat dissipation by through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Chien Ling Hwang | 2013-08-13 |
| 8387674 | Chip on wafer bonder | Chen-Hua Yu, Weng-Jin Wu, Jean Wang, Wen-Chih Chiou | 2013-03-05 |
| 8179748 | Limiting switch control method including an appended-function unit | — | 2012-05-15 |
| 8109407 | Apparatus for storing substrates | Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Ming-Shih Yeh | 2012-02-07 |
| 7981212 | Flash lamp annealing device | Fu-Kang Tien | 2011-07-19 |
| 7758338 | Substrate carrier, port apparatus and facility interface and apparatus including same | Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Fu-Kang Tien | 2010-07-20 |