Issued Patents All Time
Showing 126–150 of 432 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069528 | Semiconductor device and method | Jung-Hau Shiu, Jen Hung Wang, Tze-Liang Lee | 2021-07-20 |
| 11054742 | EUV metallic resist performance enhancement via additives | An-Ren Zi, Joy Cheng | 2021-07-06 |
| 11043388 | Integrated circuit fabrication system with adjustable gas injector and method utilizing the same | Yung-Shun Hsu, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin | 2021-06-22 |
| 11037882 | Overlay mark | Chen Chen, Ming-Feng Shieh | 2021-06-15 |
| 11037820 | Method for forming vias and method for forming contacts in vias | Tzu-Yang Lin, Cheng-Han Wu, Chin-Hsiang Lin | 2021-06-15 |
| 11036137 | Method for forming semiconductor structure | An-Ren Zi, Chin-Hsiang Lin | 2021-06-15 |
| 11029602 | Photoresist composition and method of forming photoresist pattern | An-Ren Zi, Chin-Hsiang Lin, Yahru Cheng | 2021-06-08 |
| 11022886 | Bottom-up material formation for planarization | Ming-Hui Weng, Cheng-Han Wu, Chin-Hsiang Lin | 2021-06-01 |
| 11022885 | Photosensitive middle layer | Chun-Chih HO, Kuan-Hsin Lo, Chin-Hsiang Lin | 2021-06-01 |
| 11016386 | Photoresist composition and method of forming photoresist pattern | An-Ren Zi, Chin-Hsiang Lin | 2021-05-25 |
| 11012549 | Smart phone with a text recognition module | Chi-Wen Liu, Kuo-Ching CHIANG | 2021-05-18 |
| 11009796 | Method for forming semiconductor structure | Ming-Hui Weng, An-Ren Zi, Chin-Hsiang Lin, Chen-Yu Liu | 2021-05-18 |
| 11003097 | Immersion lithography system using a sealed wafer bath | Burn Jeng Lin | 2021-05-11 |
| 11003084 | Method for forming semiconductor structure | Li-Yen Lin, Chin-Hsiang Lin | 2021-05-11 |
| 11003082 | Method for forming semiconductor structure | Chien-Chih Chen, Yahru Cheng | 2021-05-11 |
| 10990013 | Method for forming semiconductor structure | An-Ren Zi, Chin-Hsiang Lin | 2021-04-27 |
| 10978301 | Morphology of resist mask prior to etching | Jung-Hau Shiu, Wei-Ren Wang, Shing-Chyang Pan, Tze-Liang Lee | 2021-04-13 |
| 10915027 | Post development treatment method and material for shrinking critical dimension of photoresist layer | Siao-Shan Wang | 2021-02-09 |
| 10879078 | Method of patterning resist layer and method of forming semiconductor structure using patterned resist layer | Chien-Wei Wang, Li-Po YANG | 2020-12-29 |
| 10872773 | Methods of reducing pattern roughness in semiconductor fabrication | Chien-Wei Wang, Joy Cheng, Chin-Hsiang Lin | 2020-12-22 |
| 10867922 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Hai-Ching Chen, Tien-I Bao | 2020-12-15 |
| 10867839 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Wan-Lin Tsai, Jung-Hau Shiu, Tze-Liang Lee | 2020-12-15 |
| 10866516 | Metal-compound-removing solvent and method in lithography | An-Ren Zi, Joy Cheng | 2020-12-15 |
| 10866517 | Lithography techniques for reducing resist swelling | Ming-Hui Weng, Cheng-Han Wu, Chin-Hsiang Lin | 2020-12-15 |
| 10867794 | Patterning method for semiconductor devices and structures resulting therefrom | Jung-Hau Shiu, Szu-Ping Tung, Chun-Kai Chen, Jen Hung Wang, Tze-Liang Lee | 2020-12-15 |