Issued Patents All Time
Showing 51–75 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670584 | Semiconductor structure with ultra thick metal and manufacturing method thereof | Chen-Fa Lu, Ching-Chung Hsu, Chung-Long Chang | 2023-06-06 |
| 11670539 | Method of making a semiconductor arrangement | Ming-Che Lee, Sheng-Chau Chen, Cheng-Hsien Chou | 2023-06-06 |
| 11665909 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-05-30 |
| 11664411 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, Sheng-Chau Chen, I-Nan Chen, Cheng-Hsien Chou | 2023-05-30 |
| 11637239 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Hsing-Lien Lin, Chin-Chieh Yang, Yu-Wen Liao, Wen-Ting Chu +1 more | 2023-04-25 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Kuo-Ming Wu, Sheng-Chan Li | 2023-03-21 |
| 11594678 | Diffusion barrier layer in programmable metallization cell | Albert Zhong, Hai-Dang Trinh, Shing-Chyang Pan | 2023-02-28 |
| 11581254 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Sheng-Chan Li | 2023-02-14 |
| 11575021 | Surface treatment and passivation for high electron mobility transistors | Han-Chin Chiu | 2023-02-07 |
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Sheng-Chau Chen | 2023-01-10 |
| 11545395 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Kuo-Ming Wu, Hau-Yi Hsiao | 2023-01-03 |
| 11545202 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-01-03 |
| 11522066 | Sidewall passivation for HEMT devices | Han-Chin Chiu, Chi-Ming Chen, Fu-Wei Yao | 2022-12-06 |
| 11430951 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Hai-Dang Trinh, Hsing-Lien Lin, Hsun-Chung Kuang, Bi-Shen Lee | 2022-08-30 |
| 11404484 | Image sensors with organic photodiodes and methods for forming the same | Chin-Wei Liang, Chia-Shiung Tsai, Hsing-Lien Lin | 2022-08-02 |
| 11374046 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, I-Nan Chen, Tzu-Hsiang Chen, Yu-Jen Wang, Yen-Ting Chiang +1 more | 2022-06-28 |
| 11367623 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Hsun-Chung Kuang, Yao-Wen Chang | 2022-06-21 |
| 11362271 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Hsing-Lien Lin, Wen-Ting Chu | 2022-06-14 |
| 11309491 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Tzu-Chung Tsai, Fa-Shen Jiang | 2022-04-19 |
| 11302663 | Film scheme for bumping | Yao-Wen Chang, Chern-Yow Hsu, Kong-Beng Thei | 2022-04-12 |
| 11270978 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Yeur-Luen Tu, Chia-Shiung Tsai | 2022-03-08 |
| 11257997 | Semiconductor structure | Chia-Hua Lin, Yao-Wen Chang, Chii-Ming Wu, Eugene Chen, Tzu-Chung Tsai | 2022-02-22 |
| 11201183 | Image sensor device and method | Yen-Chang Chu, Yeur-Luen Tu | 2021-12-14 |
| 11189583 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou +1 more | 2021-11-30 |
| 11183394 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Hsun-Chung Kuang, Yao-Wen Chang | 2021-11-23 |