Issued Patents All Time
Showing 26–50 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080738 | Image sensor having stacked metal oxide films as fixed charge film | Chih-Yu Lai, Min-Ying Tsai, Yeur-Luen Tu, Hai-Dang Trinh | 2024-09-03 |
| 12075626 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Hsun-Chung Kuang | 2024-08-27 |
| 12069971 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Hsing-Lien Lin, Wen-Ting Chu | 2024-08-20 |
| 12046550 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Sheng-Chan Li | 2024-07-23 |
| 12035537 | Interface film to mitigate size effect of memory device | Bi-Shen Lee, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang | 2024-07-09 |
| 12027554 | Composite deep trench isolation structure in an image sensor | Che-Wei Yang, Sheng-Chan Li, Tsun-Kai Tsao, Chih-Cheng Shih, Sheng-Chau Chen | 2024-07-02 |
| 12021113 | Amorphous bottom electrode structure for MIM capacitors | Hsing-Lien Lin, Jui-Lin Chu | 2024-06-25 |
| 12021066 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Yeur-Luen Tu, Chia-Shiung Tsai | 2024-06-25 |
| 11961545 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh | 2024-04-16 |
| 11951569 | Damage prevention during wafer edge trimming | Kuo-Ming Wu, Yung-Lung Lin, Hau-Yi Hsiao, Sheng-Chau Chen | 2024-04-09 |
| 11895933 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Hai-Dang Trinh, Hsing-Lien Lin, Hsun-Chung Kuang, Bi-Shen Lee | 2024-02-06 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Kuo-Ming Wu, Sheng-Chan Li | 2024-01-02 |
| 11855109 | Image sensor device and method | Yen-Chang Chu, Yeur-Luen Tu | 2023-12-26 |
| 11844226 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-12-12 |
| 11778931 | Diffusion barrier layer in programmable metallization cell | Albert Zhong, Hai-Dang Trinh, Shing-Chyang Pan | 2023-10-03 |
| 11758830 | Memory device structure with protective element | Hai-Dang Trinh, Hsing-Lien Lin | 2023-09-12 |
| 11737280 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Tzu-Yu Lin, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang | 2023-08-22 |
| 11735635 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Lan-Lin Chao | 2023-08-22 |
| 11723212 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Hsun-Chung Kuang | 2023-08-08 |
| 11721794 | Method for manufacturing reflective structure | Chia-Hua Lin, Yao-Wen Chang, Chii-Ming Wu, Eugene Chen, Tzu-Chung Tsai | 2023-08-08 |
| 11716913 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Tzu-Chung Tsai, Fa-Shen Jiang | 2023-08-01 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Kuo-Ming Wu | 2023-08-01 |
| 11705470 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Hsien Chou, Keng-Yu Chou, Yeur-Luen Tu | 2023-07-18 |
| 11683999 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Hsing-Lien Lin, Wen-Ting Chu | 2023-06-20 |
| 11682652 | Notched wafer and bonding support structure to improve wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen | 2023-06-20 |