Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636737 | Structure and method of metal wraparound for low via resistance | Jie Deng, John Jianhong Zhu, Giridhar Nallapati | 2020-04-28 |
| 10636789 | Transistor with low resistivity carbon alloy | Ye Lu, Bin Yang, Lixin Ge, Yun Yue | 2020-04-28 |
| 10615113 | Rotated metal-oxide-metal (RTMOM) capacitor | Xia Li, Bin Yang, Gengming Tao | 2020-04-07 |
| 10566413 | MIM capacitor containing negative capacitance material | Ye Lu, Bin Yang | 2020-02-18 |
| 10354955 | Graphene as interlayer dielectric | Ye Lu, Bin Yang | 2019-07-16 |
| 10347821 | Electrode structure for resistive memory device | Yu Lu, Xia Li, Seung H. Kang | 2019-07-09 |
| 10325979 | High density and reliable vertical natural capacitors | Jun Chen, Yangyang SUN, Stanley Seungchul Song, Giridhar Nallapati | 2019-06-18 |
| 10263080 | Transistor with fluorinated graphene spacer | Ye Lu, Bin Yang, Lixin Ge, Yun Yue | 2019-04-16 |
| 10186482 | Self aligned via fuse | Samuel S. Choi, Wai-Kin Li | 2019-01-22 |
| 10177031 | Subtractive etch interconnects | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2019-01-08 |
| 10062763 | Method and apparatus for selectively forming nitride caps on metal gate | Haining Yang, Yanxiang Liu, Jeffrey Junhao Xu | 2018-08-28 |
| 10049926 | Metal lines having etch-bias independent height | Wai-Kin Li | 2018-08-14 |
| 10043796 | Vertically stacked nanowire field effect transistors | Vladimir Machkaoutsan, Stanley Seungchul Song, Mustafa Badaroglu, John Jianhong Zhu, Jeffrey Junhao Xu +3 more | 2018-08-07 |
| 9953979 | Contact wrap around structure | Jeffrey Junhao Xu, Stanley Seungchul Song, Vladimir Machkaoutsan, Mustafa Badaroglu, John Jianhong Zhu +2 more | 2018-04-24 |
| 9893011 | Back-end electrically programmable fuse | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +3 more | 2018-02-13 |
| 9865798 | Electrode structure for resistive memory device | Yu Lu, Xia Li, Seung H. Kang | 2018-01-09 |
| 9799560 | Self-aligned structure | Stanley Seungchul Song, Jeffrey Junhao Xu, Kern Rim, Da Yang, John Jianhong Zhu +4 more | 2017-10-24 |
| 9793164 | Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices | Vladimir Machkaoutsan, Stanley Seungchul Song, John Jianhong Zhu, Jeffrey Junhao Xu, Mustafa Badaroglu +2 more | 2017-10-17 |
| 9721891 | Integrated circuit devices and methods | Jeffrey Junhao Xu, John Jianhong Zhu, Stanley Seungchul Song, Niladri Narayan Mojumder, Choh Fei Yeap | 2017-08-01 |
| 9685404 | Back-end electrically programmable fuse | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +3 more | 2017-06-20 |
| 9559051 | Method for manufacturing in a semiconductor device a low resistance via without a bottom liner | Yongchun Xin, Jang Sim, Zhigang Song, Yunsheng Song | 2017-01-31 |
| 9543248 | Integrated circuit devices and methods | Jeffrey Junhao Xu, John Jianhong Zhu, Stanley Seungchul Song, Niladri Narayan Mojumder, Choh Fei Yeap | 2017-01-10 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |
| 9536842 | Structure with air gap crack stop | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-09-27 |