Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431346 | Graphene-metal E-fuse | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim, Naftali E. Lustig +1 more | 2016-08-30 |
| 9425144 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more | 2016-08-23 |
| 9412654 | Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step | Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag, Richard S. Wise, Yiheng Xu | 2016-08-09 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-08-02 |
| 9385038 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-07-05 |
| 9337082 | Metal lines having etch-bias independent height | Wai-Kin Li | 2016-05-10 |
| 9324634 | Semiconductor interconnect structure having a graphene-based barrier metal layer | Shaoning Yao, Xuesong Li, Samuel S. Choi | 2016-04-26 |
| 9324635 | Semiconductor interconnect structure having a graphene-based barrier metal layer | Samuel S. Choi, Xuesong Li, Shaoning Yao | 2016-04-26 |
| 9324655 | Modified via bottom for beol via efuse | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-04-26 |
| 9293412 | Graphene and metal interconnects with reduced contact resistance | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-03-22 |
| 9257391 | Hybrid graphene-metal interconnect structures | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-02-09 |
| 9240376 | Self-aligned via fuse | Samuel S. Choi, Wai-Kin Li | 2016-01-19 |
| 9202743 | Graphene and metal interconnects | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2015-12-01 |
| 9171801 | E-fuse with hybrid metallization | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2015-10-27 |
| 9105638 | Via-fuse with low dielectric constant | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li, Naftali E. Lustig +1 more | 2015-08-11 |
| 9099468 | Electronic fuse vias in interconnect structures | Griselda Bonilla, Samuel S. Choi, Daniel C. Edelstein, Ronald G. Filippi, Naftali E. Lustig +1 more | 2015-08-04 |
| 9093452 | Electronic fuse with resistive heater | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li, Naftali E. Lustig +1 more | 2015-07-28 |
| 9076847 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2015-07-07 |
| 9064871 | Vertical electronic fuse | Elbert E. Huang, Yan Li, Dan Moy | 2015-06-23 |
| 9059170 | Electronic fuse having a damaged region | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li, Erdem Kaltalioglu +4 more | 2015-06-16 |
| 9034664 | Method to resolve hollow metal defects in interconnects | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2015-05-19 |
| 8962467 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more | 2015-02-24 |
| 8921167 | Modified via bottom for BEOL via efuse | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2014-12-30 |
| 8916461 | Electronic fuse vias in interconnect structures | Griselda Bonilla, Samuel S. Choi, Daniel C. Edelstein, Ronald G. Filippi, Naftali E. Lustig +1 more | 2014-12-23 |
| 8841208 | Method of forming vertical electronic fuse interconnect structures including a conductive cap | Elbert E. Huang, Yan Li, Dan Moy | 2014-09-23 |