Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432897 | Cooling approaches for stitched dies | Abhishek A. Sharma, Christopher M. Pelto, Mark C. Phillips, Swaminathan Sivakumar | 2025-09-30 |
| 12412835 | Back-side power delivery with glass support at the front | Abhishek A. Sharma, Telesphor Kamgaing | 2025-09-09 |
| 12406956 | Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers | Abhishek A. Sharma, Van H. Le, Kimin Jun, Hui Jae Yoo | 2025-09-02 |
| 12400997 | Hybrid manufacturing with modified via-last process | Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly, Van H. Le | 2025-08-26 |
| 12396155 | Backend memory with air gaps in upper metal layers | Abhishek A. Sharma, Albert Chen, Fatih Hamzaoglu, Travis W. Lajoie, Van H. Le +3 more | 2025-08-19 |
| 12381193 | Integrated circuit assemblies | Abhishek A. Sharma, Van H. Le, Doug B. Ingerly | 2025-08-05 |
| 12355002 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2025-07-08 |
| 12327809 | Vertically stacked and bonded memory arrays | Abhishek A. Sharma, Mauro J. Kobrinsky | 2025-06-10 |
| 12327581 | Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors | Abhishek A. Sharma, Uygar E. Avci | 2025-06-10 |
| 12310001 | Decoupling capacitors and methods of fabrication | Juan G. Alzate-Vinasco, Travis W. Lajoie, Fatih Hamzaoglu, Pulkit Jain, James Waldemer +4 more | 2025-05-20 |
| 12310032 | Stacked backend memory with resistive switching devices | Abhishek A. Sharma, Van H. Le, Hui Jae Yoo | 2025-05-20 |
| 12278229 | Hybrid manufacturing for integrated circuit devices and assemblies | Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly | 2025-04-15 |
| 12271306 | Integrated three-dimensional (3D) DRAM cache | Adrian C. Moga, Abhishek A. Sharma | 2025-04-08 |
| 12197007 | Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer | Abhishek A. Sharma | 2025-01-14 |
| 12176147 | Three-dimensional capacitors with double metal electrodes | James Waldemer, Matthieu Giraud-Carrier, Bernhard Sell, Travis W. Lajoie, Abhishek A. Sharma | 2024-12-24 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer | 2024-12-17 |
| 12147083 | Hybrid manufacturing for integrating photonic and electronic components | Abhishek A. Sharma, Mauro J. Kobrinsky | 2024-11-19 |
| 12148747 | Gallium nitride (GAN) three-dimensional integrated circuit technology | Han Wui Then, Marko Radosavljevic, Pratik KOIRALA, Nicole K. Thomas, Paul B. Fischer +5 more | 2024-11-19 |
| 12120865 | Arrays of double-sided dram cells including capacitors on the frontside and backside of a stacked transistor structure | Cheng-Ying Huang, Ashish Agrawal, Gilbert Dewey, Abhishek A. Sharma, Jack T. Kavalieros | 2024-10-15 |
| 12114479 | Three-dimensional memory arrays with layer selector transistors | Mauro J. Kobrinsky, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more | 2024-10-08 |
| 12074138 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2024-08-27 |
| 12058849 | Three-dimensional nanoribbon-based dynamic random-access memory | Kinyip Phoa, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2024-08-06 |
| 11984430 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2024-05-14 |
| 11978727 | Package on active silicon semiconductor packages | Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11901347 | Microelectronic package with three-dimensional (3D) monolithic memory die | Mauro J. Kobrinsky, Doug B. Ingerly, Tahir Ghani | 2024-02-13 |