Issued Patents All Time
Showing 25 most recent of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130954 | Method for producing a security device | Thomas Bergmüller | 2024-10-29 |
| 12052262 | System and method to manage privileges | Thomas Bergmüller | 2024-07-30 |
| 11687677 | Method for producing a security device | Thomas Bergmüller | 2023-06-27 |
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Mark W. Kapfhammer | 2022-12-06 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh | 2022-07-19 |
| 11390107 | Object marking for optical authentication and method for producing same | — | 2022-07-19 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11281954 | Tamper-activated authenticable security device | Thomas Bergmüller | 2022-03-22 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles L. Arvin, Steven P. Ostrander | 2022-02-01 |
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Luca Del Carro, Thomas J. Brunschwiler, Chris Muzzy | 2022-02-01 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Steven P. Ostrander, Thomas E. Lombardi | 2022-01-18 |
| 11168400 | Formation of terminal metallurgy on laminates and boards | Charles L. Arvin, Brian M. Erwin, Chris Muzzy | 2021-11-09 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Mark W. Kapfhammer | 2021-06-08 |
| 11030501 | Sheet-like product and method for authenticating a security tag | Thomas Bergmüller | 2021-06-08 |
| 10957650 | Bridge support structure | Charles L. Arvin, Karen P. McLaughlin, Brian W. Quinlan | 2021-03-23 |
| 10950573 | Lead-free column interconnect | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Krishna R. Tunga | 2021-03-16 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Mark W. Kapfhammer, Shidong Li | 2021-02-09 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds | 2021-01-12 |
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds | 2020-11-17 |
| 10833051 | Precision alignment of multi-chip high density interconnects | Charles L. Arvin, Thomas A. Wassick, Steve Ostrander | 2020-11-10 |
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga | 2020-11-10 |
| 10756031 | Decoupling capacitor stiffener | Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Charles L. Reynolds, Krishna R. Tunga | 2020-08-25 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Shidong Li, Sushumna Iruvanti | 2020-04-28 |
| 10624202 | Tamper-respondent assemblies with bond protection | William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more | 2020-04-14 |