Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417925 | Method of conductive material deposition | Hirokazu Aizawa, Kai-Hung Yu, Yusuke Yoshida, Kandabara Tapily | 2025-09-16 |
| 12334391 | Method for patterning a substrate using photolithography | Katie Lutker-Lee, Angelique Raley | 2025-06-17 |
| 12057322 | Methods for etching metal films using plasma processing | Devi Koty, Qingyun Yang, Nathan P. Marchack, Sebastian U. Engelmann | 2024-08-06 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2023-04-04 |
| 11450562 | Method of bottom-up metallization in a recessed feature | Kai-Hung Yu, Jodi Grzeskowiak, Jeffrey Smith | 2022-09-20 |
| 11322364 | Method of patterning a metal film with improved sidewall roughness | Angelique Raley | 2022-05-03 |
| 11133194 | Method for selective etching at an interface between materials | Sergey Voronin, Christopher Catano, Alok Ranjan, Christopher Talone | 2021-09-28 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |
| 10903077 | Methods to protect nitride layers during formation of silicon germanium nano-wires in microelectronic workpieces | Yusuke Yoshida, Christopher Catano, Christopher Talone, Sergey Voronin | 2021-01-26 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Kaoru Maekawa, Robert D. Clark | 2020-12-08 |
| 10734278 | Method of protecting low-K layers | Hirokazu Aizawa, Karthikeyan Pillai, Kandabara Tapily | 2020-08-04 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2020-03-03 |
| 10256095 | Method for high throughput using beam scan size and beam position in gas cluster ion beam processing system | Soo Doo Chae, Noel Russell, Joshua LaRose, Luis Fernandez, Allen J. Leith +3 more | 2019-04-09 |
| 9875947 | Method of surface profile correction using gas cluster ion beam | Noel Russell, Soo Doo Chae, Vincent Gizzo, Joshua LaRose | 2018-01-23 |