Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh | 2021-09-21 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2020-04-14 |
| 10453785 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh | 2019-10-22 |
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Yang Tan | 2019-10-15 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Kang Chen, Seng Guan Chow, Yaojian Lin | 2019-05-21 |
| 10163747 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Kang Chen, Seng Guan Chow, Yaojian Lin | 2018-12-25 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Kang Chen, Seng Guan Chow, Yaojian Lin | 2017-03-28 |
| 9443797 | Semiconductor device having wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Yang Tan | 2016-09-13 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2016-03-22 |
| 9281259 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP | Yaojian Lin, Kang Chen, Glenn Omandam | 2016-03-08 |
| 9153544 | Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die | Reza A. Pagaila, Pandi C. Marimuthu | 2015-10-06 |
| 9142428 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Kang Chen, Hin Hwa Goh | 2015-09-22 |
| 9076737 | Integrated circuit packaging system with bumps and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Lionel Chien Hui Tay | 2015-07-07 |
| 9059157 | Integrated circuit packaging system with substrate and method of manufacture thereof | Yaojian Lin, Il Kwon Shim, JunMo Koo | 2015-06-16 |
| 9054083 | Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more | 2015-06-09 |
| 8710635 | Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die | Reza A. Pagaila, Pandi C. Marimuthu | 2014-04-29 |
| 8698294 | Integrated circuit package system including wide flange leadframe | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-04-15 |
| 8664038 | Integrated circuit packaging system with stacked paddle and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Lionel Chien Hui Tay | 2014-03-04 |
| 8659162 | Semiconductor device having an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more | 2014-02-25 |
| 8648470 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Kang Chen, Hin Hwa Goh | 2014-02-11 |
| 8610286 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP | Yaojian Lin, Kang Chen, Glenn Omandam | 2013-12-17 |
| 8569872 | Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho, Philip Lyndon Cablao | 2013-10-29 |
| 8502376 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2013-08-06 |
| 8455988 | Integrated circuit package system with bumped lead and nonbumped lead | Zigmund Ramirez Camacho | 2013-06-04 |
| 8399306 | Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof | JunMo Koo, Pandi C. Marimuthu, Jae Hun Ku, Shariff Dzafir | 2013-03-19 |