Issued Patents All Time
Showing 26–50 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406472 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Dinh Dang, Thai Doan, George A. Dunbar, III, Russell T. Herrin, Christopher V. Jahnes +5 more | 2016-08-02 |
| 9390969 | Integrated circuit and interconnect, and method of fabricating same | David A. DeMuynck, Daniel R. Miga, Matthew D. Moon, Daniel S. Vanslette, Eric J. White | 2016-07-12 |
| 9355972 | Method for making a dielectric region in a bulk silicon substrate providing a high-Q passive resonator | James S. Dunn, Qizhi Liu | 2016-05-31 |
| 9323008 | Optoelectronic structures having multi-level optical waveguides and methods of forming the structures | Qizhi Liu, Ronald G. Meunier, Steven M. Shank | 2016-04-26 |
| 9312140 | Semiconductor structures having low resistance paths throughout a wafer | Jeffrey P. Gambino, Thomas J. Hartswick, Anthony K. Stamper, Eric J. White | 2016-04-12 |
| 9287345 | Semiconductor structure with thin film resistor and terminal bond pad | Fen Chen, Jeffrey P. Gambino, Tom C. Lee, John C. Malinowski, Anthony K. Stamper | 2016-03-15 |
| 9269666 | Methods for selective reverse mask planarization and interconnect structures formed thereby | Anthony K. Stamper, Eric J. White | 2016-02-23 |
| 9252080 | Dielectric cover for a through silicon via | Daniel J. Couture, Jeffrey P. Gambino, Anthony K. Stamper | 2016-02-02 |
| 9231046 | Capacitor using barrier layer metallurgy | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-01-05 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-01-05 |
| 9230914 | Copper wire and dielectric with air gaps | Fen Chen, Jeffrey P. Gambino, Trevor A. Thompson, Eric J. White | 2016-01-05 |
| 9159671 | Copper wire and dielectric with air gaps | Fen Chen, Jeffrey P. Gambino, Trevor A. Thompson, Eric J. White | 2015-10-13 |
| 9093503 | Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure | Fen Chen, Mukta G. Farooq, Jeffrey P. Gambino, Kevin S. Petrarca, Anthony K. Stamper | 2015-07-28 |
| 9087839 | Semiconductor structures with metal lines | Shawn A. Adderly, Daniel A. Delibac, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +2 more | 2015-07-21 |
| 9087808 | Fabricating polysilicon MOS devices and passive ESD devices | John J. Ellis-Monaghan, Michael J. Hauser, Junjun Li, Xuefeng Liu, Anthony K. Stamper | 2015-07-21 |
| 9059183 | Structure of very high insertion loss of the substrate noise decoupling | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2015-06-16 |
| 9059138 | Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure | Renata Camillo-Castillo, Jeffrey B. Johnson, Qizhi Liu, Xuefeng Liu | 2015-06-16 |
| 8975531 | Composite copper wire interconnect structures and methods of forming | Felix P. Anderson, Anthony K. Stamper | 2015-03-10 |
| 8951893 | Fabricating polysilicon MOS devices and passive ESD devices | John J. Ellis-Monaghan, Michael J. Hauser, Junjun Li, Xuefeng Liu, Anthony K. Stamper | 2015-02-10 |
| 8927869 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-06 |
| 8900964 | Inductors and wiring structures fabricated with limited wiring material | Hanyi Ding, Jeffrey P. Gambino, Alvin J. Joseph, Anthony K. Stamper, Timothy D. Sullivan | 2014-12-02 |
| 8901710 | Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitance | Frederick G. Anderson, Natalie B. Feilchenfeld, Theodore Letavic, Yves T. Ngu | 2014-12-02 |
| 8865497 | Planar cavity MEMS and related structures, methods of manufacture and design structures | George A. Dunbar, III, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper | 2014-10-21 |
| 8857022 | Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors | James S. Dunn, Anthony K. Stamper | 2014-10-14 |
| 8860191 | On-chip transmission line structures with balanced phase delay | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2014-10-14 |