Issued Patents All Time
Showing 76–100 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8435864 | Process for single and multiple level metal-insulator-metal integration with a single mask | Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Ebenezer E. Eshun, Robert M. Rassel +1 more | 2013-05-07 |
| 8421183 | Structure of very high insertion loss of the substrate noise decoupling | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2013-04-16 |
| 8399927 | Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate | Hanyi Ding, Kai D. Feng, Zhenrong Jin, Xuefeng Liu, Yun Shi | 2013-03-19 |
| 8390038 | MIM capacitor and method of making same | Douglas D. Coolbaugh, Ebenezer E. Eshun, Robert M. Rassel | 2013-03-05 |
| 8378450 | Interdigitated vertical parallel capacitor | Roger A. Booth, Jr., Douglas D. Coolbaugh, Ebenezer E. Eshun | 2013-02-19 |
| 8375539 | Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors | James S. Dunn, Anthony K. Stamper | 2013-02-19 |
| 8362794 | Method and system for assessing reliability of integrated circuit | Fen Chen, Kai D. Feng | 2013-01-29 |
| 8338920 | Package integrated soft magnetic film for improvement in on-chip inductor performance | John M. Cotte, Hanyi Ding, Kai D. Feng, Nils D. Hoivik, Xuefeng Liu | 2012-12-25 |
| 8299475 | Interlevel conductive light shield | Jeffrey P. Gambino, Kevin N. Ogg, Richard J. Rassel, Robert M. Rassel | 2012-10-30 |
| 8298902 | Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit | Timothy J. Dalton, Ebenezer E. Eshun, Sarah L. Grunow, Anthony K. Stamper | 2012-10-30 |
| 8279572 | Structure for an on-chip high frequency electro-static discharge device | Hanyi Ding, Kai D. Feng, Xuefeng Liu, Anthony K. Stamper | 2012-10-02 |
| 8242542 | Semiconductor switching device employing a quantum dot structure | Qizhi Liu | 2012-08-14 |
| 8237463 | Method for managing circuit reliability | Fen Chen, Kai D. Feng | 2012-08-07 |
| 8232920 | Integrated millimeter wave antenna and transceiver on a substrate | Hanyi Ding, Kai D. Feng, Zhenrong Jin, Xuefeng Liu | 2012-07-31 |
| 8232173 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Hanyi Ding, Mete Erturk, Robert A. Groves, Peter J. Lindgren, Anthony K. Stamper | 2012-07-31 |
| 8227849 | Method and structure for creation of a metal insulator metal capacitor | Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Keith E. Downes, Natalie B. Feilchenfeld | 2012-07-24 |
| 8227300 | Semiconductor switching circuit employing quantum dot structures | Qizhi Liu | 2012-07-24 |
| 8207568 | Process for single and multiple level metal-insulator-metal integration with a single mask | Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Ebenezer E. Eshun, Robert M. Rassel +1 more | 2012-06-26 |
| 8191217 | Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture | James S. Dunn, Anthony K. Stamper | 2012-06-05 |
| 8171435 | Integrated circuit structure incorporating an inductor, an associated design method and an associated design system | Robert M. Rassel, Steven H. Voldman | 2012-05-01 |
| 8159040 | Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor | Douglas D. Coolbaugh, Ebenezer E. Eshun, Ephrem G. Gebreselasie, Herbert L. Ho, Deok-kee Kim +8 more | 2012-04-17 |
| 8158988 | Interlevel conductive light shield | Jeffrey P. Gambino, Kevin N. Ogg, Richard J. Rassel, Robert M. Rassel | 2012-04-17 |
| 8129844 | Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices | Felix P. Anderson, Thomas L. McDevitt, Eric J. White | 2012-03-06 |
| 8120110 | Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate | Hanyi Ding, Kai D. Feng, Zhenrong Jin, Xuefeng Liu, Yun Shi | 2012-02-21 |
| 8101494 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | David S. Collins, Kai D. Feng, Peter J. Lindgren, Robert M. Rassel | 2012-01-24 |