Issued Patents All Time
Showing 51–75 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847401 | Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure | Fen Chen, Jeffrey P. Gambino, Xin Wang, Yanfeng Wang | 2014-09-30 |
| 8841750 | Local wiring for a bipolar junction transistor including a self-aligned emitter region | David L. Harame, Qizhi Liu | 2014-09-23 |
| 8842412 | Tapered via and MIM capacitor | James S. Dunn, Anthony K. Stamper | 2014-09-23 |
| 8822993 | Integrated circuit including sensor structure, related method and design structure | Edward C. Cooney, III, Jeffrey P. Gambino, Tom C. Lee | 2014-09-02 |
| 8815733 | Isolated wire structures with reduced stress, methods of manufacturing and design structures | Jeffrey P. Gambino, Tom C. Lee | 2014-08-26 |
| 8809155 | Back-end-of-line metal-oxide-semiconductor varactors | John J. Ellis-Monaghan, Michael J. Hauser, Xuefeng Liu, Richard A. Phelps, Robert M. Rassel +1 more | 2014-08-19 |
| 8803284 | Thick on-chip high-performance wiring structures | Edward C. Cooney, III, Jeffrey P. Gambino, Tom C. Lee, Xiao Hu Liu | 2014-08-12 |
| 8791545 | Interconnect structures and design structures for a radiofrequency integrated circuit | Timothy J. Dalton, Ebenezer E. Eshun, Sarah L. Grunow, Anthony K. Stamper | 2014-07-29 |
| 8765595 | Thick on-chip high-performance wiring structures | Edward C. Cooney, III, Jeffrey P. Gambino, Tom C. Lee, Xiao Hu Liu | 2014-07-01 |
| 8710661 | Methods for selective reverse mask planarization and interconnect structures formed thereby | Anthony K. Stamper, Eric J. White | 2014-04-29 |
| 8709855 | Intralevel conductive light shield | Jeffrey P. Gambino, Kevin N. Ogg, Richard J. Rassel, Robert M. Rassel | 2014-04-29 |
| 8674423 | Semiconductor structure having vias and high density capacitors | David S. Collins, Kai D. Feng, Peter J. Lindgren, Robert M. Rassel | 2014-03-18 |
| 8659173 | Isolated wire structures with reduced stress, methods of manufacturing and design structures | Jeffrey P. Gambino, Tom C. Lee | 2014-02-25 |
| 8649153 | Tapered via and MIM capacitor | James S. Dunn, Anthony K. Stamper | 2014-02-11 |
| 8645898 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Hanyi Ding, Mete Erturk, Robert A. Groves, Peter J. Lindgren, Anthony K. Stamper | 2014-02-04 |
| 8624318 | Semiconductor switching circuit employing quantum dot structures | Qizhi Liu | 2014-01-07 |
| 8604618 | Structure and method for reducing vertical crack propagation | Edward C. Cooney, III, Jeffrey P. Gambino, Xiao Hu Liu, Thomas L. McDevitt, Gary L. Milo +1 more | 2013-12-10 |
| 8589832 | On chip shielding structure for integrated circuits or devices on a substrate and method of shielding | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2013-11-19 |
| 8575022 | Top corner rounding of damascene wire for insulator crack suppression | Gregory S. Chrisman, Edward C. Cooney, III, Jeffrey P. Gambino, Thomas L. McDevitt, Eva A. Shah | 2013-11-05 |
| 8563336 | Method for forming thin film resistor and terminal bond pad simultaneously | Fen Chen, Jeffrey P. Gambino, Tom C. Lee, John C. Malinowski, Anthony K. Stamper | 2013-10-22 |
| 8566759 | Structure for on chip shielding structure for integrated circuits or devices on a substrate | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2013-10-22 |
| 8518817 | Method of electrolytic plating and semiconductor device fabrication | Felix P. Anderson, Anthony K. Stamper, Eric J. White | 2013-08-27 |
| 8519892 | Integrated millimeter wave antenna and transceiver on a substrate | Hanyi Ding, Kai D. Feng, Zhenrong Jin, Xuefeng Liu | 2013-08-27 |
| 8497203 | Semiconductor structures and methods of manufacture | Fen Chen, Anthony K. Stamper | 2013-07-30 |
| 8445967 | Semiconductor switching device employing a quantum dot structure | Qizhi Liu | 2013-05-21 |