Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10782606 | Photolithography methods and structures that reduce stochastic defects | Yong Liang, Lei Sun, Craig D. Higgins | 2020-09-22 |
| 10749011 | Area selective cyclic deposition for VFET top spacer | Zhenxing Bi, Kangguo Cheng, Yi Song | 2020-08-18 |
| 10672705 | Method of forming a straight via profile with precise critical dimension control | Junli Wang, Yann Mignot, Joe Lee | 2020-06-02 |
| 10658180 | EUV pattern transfer with ion implantation and reduced impact of resist residue | Yann Mignot, Oleg Gluschenkov | 2020-05-19 |
| 10658190 | Extreme ultraviolet lithography patterning with directional deposition | Ekmini Anuja De Silva, Su Chen Fan, Yann Mignot | 2020-05-19 |
| 10629436 | Spacer image transfer with double mandrel | Yann Mignot | 2020-04-21 |
| 10622301 | Method of forming a straight via profile with precise critical dimension control | Junli Wang, Yann Mignot, Joe Lee | 2020-04-14 |
| 10607922 | Controlling via critical dimension during fabrication of a semiconductor wafer | Yann Mignot, Muthumanickam Sankarapandian | 2020-03-31 |
| 10573528 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Dongbing Shao, Robert C. Wong | 2020-02-25 |
| 10573520 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2020-02-25 |
| 10559467 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yann Mignot | 2020-02-11 |
| 10551742 | Tunable adhesion of EUV photoresist on oxide surface | Jing Guo, Ekmini Anuja De Silva, Oleg Gluschenkov | 2020-02-04 |
| 10431646 | Electronic devices having spiral conductive structures | Peng Xu, Kangguo Cheng, Xuefeng Liu, Chi-Chun Liu | 2019-10-01 |
| 10396179 | Forming vertical transport field effect transistors with uniform bottom spacer thickness | Kangguo Cheng, Xuefeng Liu, Peng Xu | 2019-08-27 |
| 10361285 | Forming vertical transport field effect transistors with uniform bottom spacer thickness | Kangguo Cheng, Xuefeng Liu, Peng Xu | 2019-07-23 |
| 10354885 | Hard masks for block patterning | Ekmini Anuja De Silva, Isabel C. Estrada-Raygoza, Yann Mignot, Indira Seshadri | 2019-07-16 |
| 10340179 | Via formation using directed self-assembly of a block copolymer | Cheng Chi, Kafai Lai, Chi-Chun Liu | 2019-07-02 |
| 10164060 | Work function metal fill for replacement gate fin field effect transistor process | Hong He, Junli Wang, Yunpeng Yin | 2018-12-25 |
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot +3 more | 2018-12-18 |
| 10147803 | Work function metal fill for replacement gate fin field effect transistor process | Hong He, Junli Wang, Yunpeng Yin | 2018-12-04 |
| 10090164 | Hard masks for block patterning | Ekmini Anuja De Silva, Isabel C. Estrada-Raygoza, Yann Mignot, Indira Seshadri | 2018-10-02 |
| 10043744 | Avoiding gate metal via shorting to source or drain contacts | Victor Chan, Xuefeng Liu, Yann Mignot | 2018-08-07 |
| 10032632 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yann Mignot | 2018-07-24 |
| 10032633 | Image transfer using EUV lithographic structure and double patterning process | Hsueh-Chung Chen, Yann Mignot | 2018-07-24 |
| 10020255 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Yann Mignot, Hosadurga Shobha, Junli Wang | 2018-07-10 |