Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302571 | Cut integration for subtractive first metal line with bottom up second metal line | Somnath Ghosh, Hsueh-Chung Chen, Yann Mignot, Lawrence A. Clevenger | 2022-04-12 |
| 11302533 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yann Mignot | 2022-04-12 |
| 11237485 | System, software application, and method for lithography stitching | Christopher Dennis Bencher, Robert Jan Visser, Ludovic Godet | 2022-02-01 |
| 11226440 | Mask orientation | Rutger Meyer Timmerman Thijssen, Jinrui GUO, Ludovic Godet | 2022-01-18 |
| 11171001 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2021-11-09 |
| 11152298 | Metal via structure | Yann Mignot, James J. Kelly, Muthumanickam Sankarapandian, Hsueh-Chung Chen, Daniel J. Vincent | 2021-10-19 |
| 11131919 | Extreme ultraviolet (EUV) mask stack processing | Zhenxing Bi, Yann Mignot, Nelson Felix, Ekmini Anuja De Silva | 2021-09-28 |
| 11111176 | Methods and apparatus of processing transparent substrates | Chien-An Chen, Ludovic Godet | 2021-09-07 |
| 11069564 | Double metal patterning | Hsueh-Chung Chen, Yann Mignot, James J. Kelly, Lawrence A. Clevenger | 2021-07-20 |
| 11062911 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Dongbing Shao, Robert C. Wong | 2021-07-13 |
| 11037822 | Svia using a single damascene interconnect | Yann Mignot, Muthumanickam Sankarapandian, Joe Lee | 2021-06-15 |
| 11031246 | EUV pattern transfer with ion implantation and reduced impact of resist residue | Yann Mignot, Oleg Gluschenkov | 2021-06-08 |
| 11022887 | Tunable adhesion of EUV photoresist on oxide surface | Jing Guo, Ekmini Anuja De Silva, Oleg Gluschenkov | 2021-06-01 |
| 10975464 | Hard mask films with graded vertical concentration formed using reactive sputtering in a radio frequency deposition chamber | Ekmini Anuja De Silva, Abraham Arceo de la Pena, Chih-Chao Yang | 2021-04-13 |
| 10957552 | Extreme ultraviolet lithography patterning with directional deposition | Ekmini Anuja De Silva, Su Chen Fan, Yann Mignot | 2021-03-23 |
| 10937653 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2021-03-02 |
| 10930504 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yann Mignot | 2021-02-23 |
| 10921721 | Measurement system and grating pattern array | Jinxin FU, Yifei Wang, Ludovic Godet | 2021-02-16 |
| 10915690 | Via design optimization to improve via resistance | Dongbing Shao, Shyng-Tsong Chen, Zheng Xu | 2021-02-09 |
| 10915085 | Developer critical dimension control with pulse development | Richard C. Johnson, Hao Tang | 2021-02-09 |
| 10886197 | Controlling via critical dimension with a titanium nitride hard mask | Yann Mignot, Muthumanickam Sankarapandian | 2021-01-05 |
| 10879068 | Extreme ultraviolet lithography for high volume manufacture of a semiconductor device | Yann Mignot, John C. Arnold, Oleg Gluschenkov | 2020-12-29 |
| 10825720 | Single trench damascene interconnect using TiN HMO | Yann Mignot, Muthumanickam Sankarapandian | 2020-11-03 |
| 10818548 | Method and structure for cost effective enhanced self-aligned contacts | Kafai Lai, Chih-Chao Yang, Su Chen Fan | 2020-10-27 |
| 10784333 | Electronic devices having spiral conductive structures | Peng Xu, Kangguo Cheng, Xuefeng Liu, Chi-Chun Liu | 2020-09-22 |