WM

William T. Motsiff

IBM: 67 patents #1,125 of 70,183Top 2%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 South Burlington, VT: #22 of 1,136 inventorsTop 2%
🗺 Vermont: #87 of 4,968 inventorsTop 2%
Overall (All Time): #32,130 of 4,157,543Top 1%
67
Patents All Time

Issued Patents All Time

Showing 26–50 of 67 patents

Patent #TitleCo-InventorsDate
6835973 Antifuse for use with low &kgr; dielectric foam insulators Timothy H. Daubenspeck, William A. Klaasen, Rosemary A. Previti-Kelly, Jed H. Rankin 2004-12-28
6827868 Thinning of fuse passivation after C4 formation Timothy H. Daubenspeck, Jeffrey P. Gambino 2004-12-07
6815838 Laser alignment target and method Timothy H. Daubenspeck, Richard A. Gilmour, Christopher D. Muzzy 2004-11-09
6806578 Copper pad structure Wayne J. Howell, Ronald L. Mendelson 2004-10-19
6798066 Heat dissipation from IC interconnects Timothy D. Sullivan, Jean Wynne, Sally J. Yankee 2004-09-28
6784516 Insulative cap for laser fusing Timothy H. Daubenspeck, Thomas L. McDevitt, Henry A. Nye, III 2004-08-31
6773952 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces Douglas S. Armbrust, William F. Clark, Jr., William A. Klaasen, Timothy D. Sullivan 2004-08-10
6746947 Post-fuse blow corrosion prevention structure for copper fuses Timothy H. Daubenspeck, Daniel C. Edelstein, Robert M. Geffken, Anthony K. Stamper, Steven H. Voldman 2004-06-08
6743710 Stacked fill structures for support of dielectric layers Timothy G. Dunham, Howard S. Landis 2004-06-01
6734047 Thinning of fuse passivation after C4 formation Timothy H. Daubenspeck, Jeffrey P. Gambino 2004-05-11
6713838 Inductive fuse for semiconductor device Wilbur D. Pricer, Rosemary A. Previti-Kelly 2004-03-30
6674168 Single and multilevel rework Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, Mark P. Murray, Amanda Piper +4 more 2004-01-06
6667533 Triple damascene fuse Timothy H. Daubenspeck, Thomas L. McDevitt, Anthony K. Stamper 2003-12-23
6661106 Alignment mark structure for laser fusing and method of use Richard A. Gilmour, William A. Klaasen 2003-12-09
6605526 Wirebond passivation pad connection using heated capillary Wayne J. Howell, Ronald L. Mendelson, Jean-Guy Quintal, Sylvain Ouimet 2003-08-12
6573538 Semiconductor device with internal heat dissipation Michael J. Shapiro 2003-06-03
6559543 Stacked fill structures for support of dielectric layers Timothy G. Dunham, Howard S. Landis 2003-05-06
6512292 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces Douglas S. Armbrust, William F. Clark, Jr., William A. Klaasen, Timothy D. Sullivan 2003-01-28
6498385 Post-fuse blow corrosion prevention structure for copper fuses Timothy H. Daubenspeck, Daniel C. Edelstein, Robert M. Geffken, Anthony K. Stamper, Steven H. Voldman 2002-12-24
6498056 Apparatus and method for antifuse with electrostatic assist William R. Tonti, Richard Q. Williams 2002-12-24
6496053 Corrosion insensitive fusible link using capacitance sensing for semiconductor devices Timothy H. Daubenspeck, Kurt R. Kimmel, William A. Klaasen, Rosemary A. Previti-Kelly, W David Pricer +1 more 2002-12-17
6492207 Method for making a pedestal fuse Dennis P. Bouldin, Timothy H. Daubenspeck 2002-12-10
6472230 Re-settable tristate programmable device Kurt R. Kimmel, J. Alex Chediak, Wilbur D. Pricer, Richard Q. Williams 2002-10-29
6458630 Antifuse for use with low k dielectric foam insulators Timothy H. Daubenspeck, William A. Klaasen, Rosemary A. Previti-Kelly, Jed H. Rankin 2002-10-01
6455914 Pedestal fuse Dennis P. Bouldin, Timothy H. Daubenspeck 2002-09-24