Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440834 | Method and structure for a semiconductor fuse | Timothy H. Daubenspeck, Jed H. Rankin | 2002-08-27 |
| 6426557 | Self-aligned last-metal C4 interconnection layer for Cu technologies | Timothy H. Daubenspeck, Stephen E. Luce | 2002-07-30 |
| 6420772 | Re-settable tristate programmable device | Kurt R. Kimmel, J. Alex Chediak, Wilbur D. Pricer, Richard Q. Williams | 2002-07-16 |
| 6375159 | High laser absorption copper fuse and method for making the same | Timothy H. Daubenspeck | 2002-04-23 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey +2 more | 2002-01-22 |
| 6335229 | Inductive fuse for semiconductor device | Wilbur D. Pricer, Rosemary A. Previti-Kelly | 2002-01-01 |
| 6261873 | Pedestal fuse | Dennis P. Bouldin, Timothy H. Daubenspeck | 2001-07-17 |
| 6249038 | Method and structure for a semiconductor fuse | Timothy H. Daubenspeck, Jed H. Rankin | 2001-06-19 |
| 6127735 | Interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey +2 more | 2000-10-03 |
| 6093630 | Semi-conductor personalization structure and method | Robert M. Geffken, Ronald R. Uttecht | 2000-07-25 |
| 5897336 | Direct chip attach for low alpha emission interconnect system | Guy Paul Brouillette, David Danovitch, Michael Liehr, Judith Marie Roldan, Carlos J. Sambucetti +1 more | 1999-04-27 |
| 5883435 | Personalization structure for semiconductor devices | Robert M. Geffken, Ronald R. Uttecht | 1999-03-16 |
| 5795819 | Integrated pad and fuse structure for planar copper metallurgy | Robert M. Geffken, Ronald R. Uttecht | 1998-08-18 |
| 5731624 | Integrated pad and fuse structure for planar copper metallurgy | Robert M. Geffken, Ronald R. Uttecht | 1998-03-24 |
| 5719070 | Metallization composite having nickel intermediate/interface | Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, Adolf E. Wirsing | 1998-02-17 |
| 5457345 | Metallization composite having nickle intermediate/interface | Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, Adolf E. Wirsing | 1995-10-10 |
| 4590258 | Polyamic acid copolymer system for improved semiconductor manufacturing | Harold G. Linde, Michael W. MacIntyre | 1986-05-20 |