TS

Theodorus E. Standaert

IBM: 284 patents #82 of 70,183Top 1%
Globalfoundries: 18 patents #182 of 4,424Top 5%
TE Tessera: 10 patents #41 of 271Top 20%
Samsung: 1 patents #49,284 of 75,807Top 70%
AM AMD: 1 patents #5,683 of 9,279Top 65%
SS Stmicroelectronics Sa: 1 patents #938 of 1,676Top 60%
AS Adeia Semiconductor Solutions: 1 patents #22 of 57Top 40%
RE Renesas Electronics: 1 patents #2,739 of 4,529Top 65%
📍 Clifton Park, NY: #2 of 1,126 inventorsTop 1%
🗺 New York: #54 of 115,490 inventorsTop 1%
Overall (All Time): #1,202 of 4,157,543Top 1%
309
Patents All Time

Issued Patents All Time

Showing 301–309 of 309 patents

Patent #TitleCo-InventorsDate
7488679 Interconnect structure and process of making the same Pegeen M. Davis, John A. Fitzsimmons, Stephen E. Greco, Tze-man Ko, Naftali E. Lustig +2 more 2009-02-10
7456099 Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices Lawrence A. Clevenger, Stephan Grunow, Kaushik A. Kumar, Kevin S. Petrarca, Vidhya Ramachandran 2008-11-25
7394154 Embedded barrier for dielectric encapsulation Paul S. McLaughlin, Sujatha Sankaran 2008-07-01
7371684 Process for preparing electronics structures using a sacrificial multilayer hardmask scheme Matthew E. Colburn, Ricardo A. Donaton, Conal E. Murray, Satyanarayana V. Nitta, Sampath Purushothaman +2 more 2008-05-13
7323410 Dry etchback of interconnect contacts William Brearley, Stephen E. Greco, Sujatha Sankaran 2008-01-29
7214608 Interlevel dielectric layer and metal layer sealing Matthew S. Angyal, Peter Biolsi, Lawrence A. Clevenger, Habib Hichri, Bernd Kastenmeier +3 more 2007-05-08
7105445 Interconnect structures with encasing cap and methods of making thereof Kwong Hon Wong, Louis C. Hsu, Timothy J. Dalton, Carl Radens, Chih-Chao Yang +1 more 2006-09-12
7071099 Forming of local and global wiring for semiconductor product Stephen E. Greco 2006-07-04
6613484 Method to decrease fluorine contamination in low dielectric constant films Timothy J. Dalton, Bernd Kastenmeier 2003-09-02