Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7528066 | Structure and method for metal integration | Chih-Chao Yang, Oscar van der Straten | 2009-05-05 |
| 7498254 | Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement | Chih-Chao Yang, Simon Gaudet, Christian Lavoie, Shom Ponoth | 2009-03-03 |
| 7494915 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +8 more | 2009-02-24 |
| 7495338 | Metal capped copper interconnect | Michael Lane, Stefanie Chiras, Robert Rosenberg, Daniel C. Edelstein | 2009-02-24 |
| 7446058 | Adhesion enhancement for metal/dielectric interface | Chih-Chao Yang, Griselda Bonilla, Qinghuang Lin | 2008-11-04 |
| 7402883 | Back end of the line structures with liner and noble metal layer | Chih-Chao Yang, Shyng-Tsong Chen, Shom Ponoth | 2008-07-22 |
| 7341948 | Method of making a semiconductor structure with a plating enhancement layer | Shom Ponoth, Steven S. Chen, John A. Fitzsimmons | 2008-03-11 |
| 7253098 | Maintaining uniform CMP hard mask thickness | Shyng-Tsong Chen, Kaushik A. Kumar, Stephen E. Greco, Shom Ponoth, David L. Rath +1 more | 2007-08-07 |
| 7223691 | Method of forming low resistance and reliable via in inter-level dielectric interconnect | Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Patrick W. DeHaven, Chester T. Dziobkowski +4 more | 2007-05-29 |
| 7215006 | Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement | Chih-Chao Yang, Simon Gaudet, Christian Lavoie, Shom Ponoth | 2007-05-08 |
| 7135398 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Stephen M. Gates, Matthew S. Angyal +3 more | 2006-11-14 |
| 7122462 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +8 more | 2006-10-17 |
| 7119018 | Copper conductor | Michael Lane, Stefanie Chiras, Robert Rosenberg, Daniel C. Edelstein | 2006-10-10 |
| 6917108 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Stephen M. Gates, Matthew S. Angyal +3 more | 2005-07-12 |
| 6784105 | Simultaneous native oxide removal and metal neutral deposition method | Chih-Chao Yang, Yun-Yu Wang, Larry Clevenger, Andrew H. Simon, Stephen E. Greco +3 more | 2004-08-31 |