Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385078 | Self aligned via in integrated circuit | Yannick Feurprier, Joe Lee, Lars Liebmann, Yann Mignot, Douglas M. Trickett +1 more | 2016-07-05 |
| 9373582 | Self aligned via in integrated circuit | Yannick Feurprier, Joe Lee, Lars Liebmann, Yann Mignot, Douglas M. Trickett +1 more | 2016-06-21 |
| 9334572 | Interconnect structure and method of making same | Ya Ou, Shom Ponoth | 2016-05-10 |
| 9332628 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami +1 more | 2016-05-03 |
| 9105693 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami +1 more | 2015-08-11 |
| 9059251 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami +1 more | 2015-06-16 |
| 8772180 | Interconnect structure and method of making same | Ya Ou, Shom Ponoth | 2014-07-08 |
| 8772933 | Interconnect structure and method of making same | Ya Ou, Shom Ponoth | 2014-07-08 |
| 8664766 | Interconnect structure containing non-damaged dielectric and a via gouging feature | Chih-Chao Yang, Oscar van der Straten | 2014-03-04 |
| 8519540 | Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same | Shyng-Tsong Chen, Qinghuang Lin, Sampath Purushothaman, Shawn Walsh | 2013-08-27 |
| 8481423 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-07-09 |
| 8470706 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-06-25 |
| 8445377 | Mechanically robust metal/low-k interconnects | Qinghuang Lin, Darshan Gandhi, Christy S. Tyberg | 2013-05-21 |
| 8415248 | Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same | Shyng-Tsong Chen, Qinghuang Lin, Sampath Purushothaman, Shawn Walsh | 2013-04-09 |
| 8288268 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami +1 more | 2012-10-16 |
| 8232195 | Method for fabricating back end of the line structures with liner and seed materials | Chih-Chao Yang, Shyng-Tsong Chen, Shom Ponoth | 2012-07-31 |
| 8129843 | Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer | John C. Arnold, Sampath Purushothaman, Muthumanickam Sankarapandian, Hosadurga Shobha | 2012-03-06 |
| 8017522 | Mechanically robust metal/low-κ interconnects | Qinghuang Lin, Darshan Gandhi, Christy S. Tyberg | 2011-09-13 |
| 8003524 | Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement | Chih-Chao Yang, Simon Gaudet, Christian Lavoie, Shom Ponoth | 2011-08-23 |
| 7816253 | Surface treatment of inter-layer dielectric | Shyng-Tsong Chen, Qinghuang Lin, Kelly Malone, Sanjay C. Mehta, Chih-Chao Yang | 2010-10-19 |
| 7795740 | Adhesion enhancement for metal/dielectric interface | Chih-Chao Yang, Griselda Bonilla, Qinghuang Lin | 2010-09-14 |
| 7781332 | Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer | John C. Arnold, Sampath Purushothaman, Muthumanickam Sankarapandian, Hosadurga Shobha | 2010-08-24 |
| 7749892 | Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices | Griselda Bonilla, Christos D. Dimitrakopoulos, Son V. Nguyen, Alfred Grill, Satyanarayana V. Nitta +1 more | 2010-07-06 |
| 7750479 | Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair | Sampath Purushothaman, Muthumanickam Sankarapandian, Hosadurga Shobha | 2010-07-06 |
| 7709344 | Integrated circuit fabrication process using gas cluster ion beam etching | Shyng-Tsong Chen, John A. Fitzsimmons, Shom Ponoth | 2010-05-04 |