Issued Patents All Time
Showing 51–75 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7674521 | Materials containing voids with void size controlled on the nanometer scale | Alfred Grill, Deborah A. Neumayer, Son V. Nguyen, Vishnubhai V. Patel | 2010-03-09 |
| 7615482 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Daniel C. Edelstein, Alexandros T. Demos, Alfred Grill, Steven E. Molis, Vu Ngoc Tran Nguyen +3 more | 2009-11-10 |
| 7521377 | SiCOH film preparation using precursors with built-in porogen functionality | Alfred Grill, Robert D. Miller, Deborah A. Neumayer, Son V. Nguyen | 2009-04-21 |
| 7517790 | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification | John A. Fitzsimmons, Michael Lane, Eric G. Liniger | 2009-04-14 |
| 7491658 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | Son V. Nguyen, Deborah A. Neumayer, Alfred Grill | 2009-02-17 |
| 7485582 | Hardmask for improved reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Xiao Hu Liu, Vincent J. McGahay, Sanjay C. Mehta +1 more | 2009-02-03 |
| 7485341 | Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same | Matthew E. Colburn, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2009-02-03 |
| 7479306 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | Daniel C. Edelstein, Alfred Grill, Michael Lane, Qinghuang Lin, Robert D. Miller +2 more | 2009-01-20 |
| 7439174 | Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics | Timothy J. Dalton, Nicholas C. M. Fuller | 2008-10-21 |
| 7378350 | Formation of low resistance via contacts in interconnect structures | Timothy J. Dalton | 2008-05-27 |
| 7371461 | Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics | Nicholas C. M. Fuller, Timothy J. Dalton | 2008-05-13 |
| 7357977 | Ultralow dielectric constant layer with controlled biaxial stress | Christos D. Dimitrakopoulos, Alfred Grill, Michael Lane, Eric G. Liniger, Xiao Hu Liu +3 more | 2008-04-15 |
| 7335980 | Hardmask for reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Xiao Hu Liu, Vincent J. McGahay, Sanjay C. Mehta +1 more | 2008-02-26 |
| 7312524 | Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made | Alfred Grill, David R. Medeiros, Deborah Newmayer, Son V. Nguyen, Vishnubhai V. Patel +1 more | 2007-12-25 |
| 7288292 | Ultra low k (ULK) SiCOH film and method | Alfred Grill | 2007-10-30 |
| 7282458 | Low K and ultra low K SiCOH dielectric films and methods to form the same | Christos D. Dimitrakopoulos, Alfred Grill, Son V. Nguyen | 2007-10-16 |
| 7256146 | Method of forming a ceramic diffusion barrier layer | Stephan A. Cohen, Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2007-08-14 |
| 7252875 | Diffusion barrier with low dielectric constant and semiconductor device containing same | Stephan A. Cohen, Alfred Grill, Vishnubhai V. Patel | 2007-08-07 |
| 7253105 | Reliable BEOL integration process with direct CMP of porous SiCOH dielectric | Christos D. Dimitrakopoulos, Vincent J. McGahay, Sanjay C. Mehta | 2007-08-07 |
| 7135398 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Terry A. Spooner, Matthew S. Angyal +3 more | 2006-11-14 |
| 7088003 | Structures and methods for integration of ultralow-k dielectrics with improved reliability | Son V. Nguyen | 2006-08-08 |
| 7049247 | Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made | Alfred Grill, David R. Medeiros, Deborah A. Neumayer, Son V. Nguyen, Vishnubhai V. Patel +1 more | 2006-05-23 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Mahadevaiyer Krishnan, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-05-16 |
| 7030468 | Low k and ultra low k SiCOH dielectric films and methods to form the same | Christos D. Dimitrakopoulos, Alfred Grill, Son V. Nguyen | 2006-04-18 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Mahadevaiyer Krishnan, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-04-04 |