Issued Patents All Time
Showing 76–100 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6989575 | Formation of arrays of microelectronic elements | Roy E. Scheuerlein | 2006-01-24 |
| 6958526 | Electronic structures with reduced capacitance | Alfred Grill | 2005-10-25 |
| 6943451 | Semiconductor devices containing a discontinuous cap layer and methods for forming same | Stanley Joseph Whitehair, Sampath Purushothaman, Satyanarayana V. Nitta, Maurice McGlashan-Powell, Kevin S. Petrarca | 2005-09-13 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more | 2005-09-06 |
| 6940173 | Interconnect structures incorporating low-k dielectric barrier films | Stephan A. Cohen, Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2005-09-06 |
| 6929982 | Patterning layers comprised of spin-on ceramic films | Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2005-08-16 |
| 6917108 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Terry A. Spooner, Matthew S. Angyal +3 more | 2005-07-12 |
| 6911400 | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same | Matthew E. Colburn, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2005-06-28 |
| 6897650 | Magnetic-field sensor device | Charles T. Black, Christopher B. Murray, Robert L. Sandstrom | 2005-05-24 |
| 6831366 | Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer | Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-12-14 |
| 6803660 | Patterning layers comprised of spin-on ceramic films | Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2004-10-12 |
| 6784485 | Diffusion barrier layer and semiconductor device containing same | Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Lynne M. Gignac, Paul C. Jamison +5 more | 2004-08-31 |
| 6780499 | Ordered two-phase dielectric film, and semiconductor device containing the same | Christopher B. Murray, Satyanarayana V. Nitta, Sampath Purushothaman | 2004-08-24 |
| 6756324 | Low temperature processes for making electronic device structures | — | 2004-06-29 |
| 6737107 | Nonoparticles formed with rigid connector compounds | Christopher B. Murray | 2004-05-18 |
| 6737727 | Electronic structures with reduced capacitance | Alfred Grill | 2004-05-18 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more | 2004-05-18 |
| 6734096 | Fine-pitch device lithography using a sacrificial hardmask | Timothy J. Dalton, Minakshisundaran Balasubramanian Anand, Michael D. Armacost, Shyng-Tsong Chen, Stephen E. Greco +2 more | 2004-05-11 |
| 6726996 | Laminated diffusion barrier | Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Thomas Ivers +3 more | 2004-04-27 |
| 6724069 | Spin-on cap layer, and semiconductor device containing same | Timothy J. Dalton, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Christy S. Tyberg | 2004-04-20 |
| 6716742 | Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics | Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-04-06 |
| 6710450 | Interconnect structure with precise conductor resistance and method to form same | Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-03-23 |
| 6677680 | Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials | Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg | 2004-01-13 |
| 6673401 | Nanoparticle structures utilizing synthetic DNA lattices | Charles T. Black, Christopher B. Murray, Shouheng Sun | 2004-01-06 |
| 6657305 | Semiconductor recessed mask interconnect technology | Stephen A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Brian Herbst, Sampath Purushothaman +1 more | 2003-12-02 |