Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378447 | Electrically programmable fuse and fabrication method | Ronald G. Filippi, Joseph M. Lukaitis, Ping-Chuan Wang | 2013-02-19 |
| 8298948 | Capping of copper interconnect lines in integrated circuit devices | Griselda Bonilla, Ronald G. Filippi, Stephan Grunow, David L. Rath, Sujatha Sankaran +3 more | 2012-10-30 |
| 8232645 | Interconnect structures, design structure and method of manufacture | Chih-Chao Yang, Daniel C. Edelstein | 2012-07-31 |
| 8232646 | Interconnect structure for integrated circuits having enhanced electromigration resistance | Griselda Bonilla, Ronald G. Filippi, Stephan Grunow, Chao-Kun Hu, Naftali E. Lustig +2 more | 2012-07-31 |
| 8120179 | Air gap interconnect structures and methods for forming the same | Cathryn J. Christiansen, Daniel C. Edelstein, Satyanarayana V. Nitta, Son V. Nguyen, Shom Ponoth +1 more | 2012-02-21 |
| 8053257 | Method for prediction of premature dielectric breakdown in a semiconductor | Hazara S. Rathore, Paul S. McLaughlin, Robert D. Edwards, Lawrence A. Clevenger, Andrew P. Cowley +2 more | 2011-11-08 |
| 8056039 | Interconnect structure for integrated circuits having improved electromigration characteristics | Ronald G. Filippi, Stephan Grunow, Chao-Kun Hu, Sujatha Sankaran, Andrew H. Simon +1 more | 2011-11-08 |
| 8003474 | Electrically programmable fuse and fabrication method | Ronald G. Filippi, Joseph M. Lukaitis, Ping-Chuan Wang | 2011-08-23 |
| 7955971 | Hybrid metallic wire and methods of fabricating same | Chih-Chao Yang, Daniel C. Edelstein, Baozhen Li | 2011-06-07 |
| 7830019 | Via bottom contact and method of manufacturing same | Lawrence A. Clevenger, Andrew P. Cowley, Jason P. Gill, Baozhen Li, Chih-Chao Yang | 2010-11-09 |
| 7776737 | Reliability of wide interconnects | Griselda Bonilla, Ronald G. Filippi, Stephan Grunow, Sujatha Sankaran, Andrew H. Simon +1 more | 2010-08-17 |
| 7749778 | Addressable hierarchical metal wire test methodology | Lawrence A. Clevenger, Timothy J. Dalton, Louis L. Hsu, Chih-Chao Yang | 2010-07-06 |
| 7745282 | Interconnect structure with bi-layer metal cap | Chih-Chao Yang, Ping-Chuan Wang | 2010-06-29 |
| 7737528 | Structure and method of forming electrically blown metal fuses for integrated circuits | Griselda Bonilla, Ronald G. Filippi, Jeffrey P. Gambino, Stephan Grunow, Chao-Kun Hu +3 more | 2010-06-15 |
| 7732924 | Semiconductor wiring structures including dielectric cap within metal cap layer | Ronald G. Filippi, Ping-Chuan Wang, Chih-Chao Yang | 2010-06-08 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2010-04-06 |
| 7683651 | Test structure for electromigration analysis and related method | Ronald G. Filippi, Ping-Chuan Wang | 2010-03-23 |
| 7671362 | Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing | Tibor Bolom, Ronald G. Filippi, Stephan Grunow, Paul S. McLaughlin, Sujatha Sankaran +3 more | 2010-03-02 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2009-12-29 |
| 7585764 | VIA bottom contact and method of manufacturing same | Lawrence A. Clevenger, Andrew P. Cowley, Jason P. Gill, Baozhen Li, Chih-Chao Yang | 2009-09-08 |
| 7563704 | Method of forming an interconnect including a dielectric cap having a tensile stress | Chih-Chao Yang, Lawrence A. Clevenger, Yun-Yu Wang, Daewon Yang | 2009-07-21 |
| 7521952 | Test structure for electromigration analysis and related method | Ronald G. Filippi, Ping-Chuan Wang | 2009-04-21 |
| 7479869 | Metal resistor and resistor material | Chih-Chao Yang, Shyng-Tsong Chen | 2009-01-20 |
| 7473636 | Method to improve time dependent dielectric breakdown | James J. Demarest, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewra, Vincent J. McGahay +2 more | 2009-01-06 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2008-07-08 |