Issued Patents All Time
Showing 51–75 of 142 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205678 | Embedded MRAM device with top via | Ashim Dutta, Dominik Metzler | 2021-12-21 |
| 11199778 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Jennifer Church, Dario L. Goldfarb, Nelson Felix | 2021-12-14 |
| 11195995 | Back-end-of-line compatible processing for forming an array of pillars | Chi-Chun Liu, Yann Mignot, Nelson Felix, John C. Arnold | 2021-12-07 |
| 11194254 | Lithography process delay characterization and effective dose compensation | Christopher F. Robinson, Luciana Meli, Cody J. Murray | 2021-12-07 |
| 11187983 | EUV patterning of monolayers for selective atomic layer deposition | Rudy J. Wojtecki, Noel Arellano, Noah Frederick Fine Nathel | 2021-11-30 |
| 11189561 | Placing top vias at line ends by selective growth of via mask from line cut dielectric | Ashim Dutta, Dominik Metzler, John C. Arnold | 2021-11-30 |
| 11177130 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Dario L. Goldfarb, Nelson Felix, Daniel A. Corliss, Rudy J. Wojtecki | 2021-11-16 |
| 11164772 | Spacer-defined process for lithography-etch double patterning for interconnects | Nelson Felix, Luciana Meli Thompson, Yann Mignot | 2021-11-02 |
| 11133195 | Inverse tone pillar printing method using polymer brush grafts | Nelson Felix, Praveen Joseph, Ashim Dutta | 2021-09-28 |
| 11131919 | Extreme ultraviolet (EUV) mask stack processing | Yongan Xu, Zhenxing Bi, Yann Mignot, Nelson Felix | 2021-09-28 |
| 11133189 | Metal cut patterning and etching to minimize interlayer dielectric layer loss | Kisup Chung, Andrew M. Greene, Siva Kanakasabapathy, Indira Seshadri | 2021-09-28 |
| 11121024 | Tunable hardmask for overlayer metrology contrast | Nelson Felix, Indira Seshadri, Stuart A. Sieg | 2021-09-14 |
| 11081566 | Self-aligned contacts for vertical field effect transistors | Su Chen Fan, Sivananda K. Kanakasabapathy | 2021-08-03 |
| 11075081 | Semiconductor device with multiple threshold voltages | Praveen Joseph, Indira Seshadri | 2021-07-27 |
| 11075266 | Vertically stacked fin semiconductor devices | Praveen Joseph, Tao Li, Indira Seshadri | 2021-07-27 |
| 11067896 | Dynamic adjustment of post exposure bake during lithography utilizing real-time feedback for wafer exposure delay | Cody J. Murray, Alex Richard Hubbard, Karen E. Petrillo, Nelson Felix | 2021-07-20 |
| 11062946 | Self-aligned contact on a semiconductor device | Ashim Dutta, Jennifer Church, Luciana Meli Thompson | 2021-07-13 |
| 11043628 | Multi-layer bottom electrode for embedded memory devices | Ashim Dutta | 2021-06-22 |
| 11037786 | Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography | Dario L. Goldfarb, Nelson Felix, Daniel A. Corliss, Rudy J. Wojtecki | 2021-06-15 |
| 11022887 | Tunable adhesion of EUV photoresist on oxide surface | Yongan Xu, Jing Guo, Oleg Gluschenkov | 2021-06-01 |
| 10998191 | Graded hardmask interlayer for enhanced extreme ultraviolet performance | Jennifer Church, Dario L. Goldfarb | 2021-05-04 |
| 10998192 | Sequential infiltration synthesis extreme ultraviolet single expose patterning | Jing Guo, Luciana Meli, Nelson Felix | 2021-05-04 |
| 10975464 | Hard mask films with graded vertical concentration formed using reactive sputtering in a radio frequency deposition chamber | Yongan Xu, Abraham Arceo de la Pena, Chih-Chao Yang | 2021-04-13 |
| 10957552 | Extreme ultraviolet lithography patterning with directional deposition | Yongan Xu, Su Chen Fan, Yann Mignot | 2021-03-23 |
| 10950440 | Patterning directly on an amorphous silicon hardmask | Abraham Arceo de la Pena, Nelson Felix | 2021-03-16 |