Issued Patents All Time
Showing 26–50 of 142 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688632 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2023-06-27 |
| 11682558 | Fabrication of back-end-of-line interconnects | Chi-Chun Liu, Ashim Dutta, Nelson Felix | 2023-06-20 |
| 11681213 | EUV pattern transfer using graded hardmask | Nelson Felix, Luciana Meli Thompson, Ashim Dutta | 2023-06-20 |
| 11621326 | Vertical field effect transistor with crosslink fin arrangement | Indira Seshadri, Ruilong Xie, Chen Zhang | 2023-04-04 |
| 11562908 | Dielectric structure to prevent hard mask erosion | Tao Li, Tsung-Sheng Kang, Praveen Joseph | 2023-01-24 |
| 11561481 | Using E0 exposures for track/cluster monitoring | Cody J. Murray, Christopher F. Robinson, Luciana Meli | 2023-01-24 |
| 11556057 | Surface treatment of titanium containing hardmasks | Dario L. Goldfarb, Indira Seshadri | 2023-01-17 |
| 11543751 | Organic photoresist adhesion to metal oxide hardmasks | Abraham Arceo de la Pena, Jennifer Church, Nelson Felix | 2023-01-03 |
| 11521894 | Partial wrap around top contact | Ruilong Xie, Julien Frougier, Eric Miller | 2022-12-06 |
| 11515431 | Enabling residue free gap fill between nanosheets | Indira Seshadri, Jing Guo, Ruqiang Bao, Muthumanickam Sankarapandian, Nelson Felix | 2022-11-29 |
| 11508823 | Low capacitance low RC wrap-around-contact | Ruilong Xie, Jing Guo, Hao Tang, Cheng Chi | 2022-11-22 |
| 11500293 | Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer | Indira Seshadri, Jing Guo, Ashim Dutta, Nelson Felix | 2022-11-15 |
| 11500290 | Adhesion promoters | Dario L. Goldfarb, Bharat Kumar, Jing Guo | 2022-11-15 |
| 11501969 | Direct extreme ultraviolet lithography on hard mask with reverse tone | Yann Mignot, Yongan Xu, Ashim Dutta, Chi-Chun Liu | 2022-11-15 |
| 11404317 | Method for fabricating a semiconductor device including self-aligned top via formation at line ends | John C. Arnold, Ashim Dutta, Dominik Metzler | 2022-08-02 |
| 11373880 | Creating different width lines and spaces in a metal layer | Christopher J. Penny, Ashim Dutta, Abraham Arceo de la Pena | 2022-06-28 |
| 11367617 | Graded hardmask interlayer for enhanced extreme ultraviolet performance | Jennifer Church, Dario L. Goldfarb | 2022-06-21 |
| 11355442 | Forming self-aligned multi-metal interconnects | Ashim Dutta | 2022-06-07 |
| 11307496 | Metal brush layer for EUV patterning | Jing Guo, Jennifer Church, Dario L. Goldfarb | 2022-04-19 |
| 11302573 | Semiconductor structure with fully aligned vias | Ashim Dutta, Praveen Joseph, Nelson Felix | 2022-04-12 |
| 11300881 | Line break repairing layer for extreme ultraviolet patterning stacks | Luciana Meli Thompson, Jing Guo, Nelson Felix | 2022-04-12 |
| 11251182 | Staggered stacked vertical crystalline semiconducting channels | Tsung-Sheng Kang, Tao Li, Ardasheir Rahman, Praveen Joseph, Indira Seshadri | 2022-02-15 |
| 11239077 | Litho-etch-litho-etch with self-aligned blocks | Chi-Chun Liu, Nelson Felix, Yann Mignot, John C. Arnold, Allen H. Gabor | 2022-02-01 |
| 11227892 | MRAM integration with BEOL interconnect including top via | Ashim Dutta, Chih-Chao Yang, Dominik Metzler | 2022-01-18 |
| 11226561 | Self-priming resist for generic inorganic hardmasks | Chi-Chun Liu, Indira Seshadri, Kristin Schmidt, Nelson Felix, Daniel P. Sanders +2 more | 2022-01-18 |