Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347767 | Stacked FET contact formation | Koichi Motoyama, Ruilong Xie, Oleg Gluschenkov | 2025-07-01 |
| 12261044 | Multi-layer hardmask for defect reduction in EUV patterning | Bhaskar Nagabhirava, Phillip Friddle, Ekimini Anuja De Silva, Dominik Metzler, Nelson Felix | 2025-03-25 |
| 12183630 | Additive interconnect formation | Ashim Dutta, Ekmini Anuja De Silva, Chih-Chao Yang | 2024-12-31 |
| 12125790 | Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via | Ashim Dutta, Ekmini Anuja De Silva, Praveen Joseph | 2024-10-22 |
| 12019376 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix | 2024-06-25 |
| 11906901 | Alternating copolymer chain scission photoresists | Dario L. Goldfarb, Ekmini Anuja De Silva, Jing Guo, Luciana Meli | 2024-02-20 |
| 11778929 | Selective encapsulation for metal electrodes of embedded memory devices | Ashim Dutta, Ekmini Anuja De Silva | 2023-10-03 |
| 11543751 | Organic photoresist adhesion to metal oxide hardmasks | Abraham Arceo de la Pena, Nelson Felix, Ekmini Anuja De Silva | 2023-01-03 |
| 11367617 | Graded hardmask interlayer for enhanced extreme ultraviolet performance | Ekmini Anuja De Silva, Dario L. Goldfarb | 2022-06-21 |
| 11307496 | Metal brush layer for EUV patterning | Ekmini Anuja De Silva, Jing Guo, Dario L. Goldfarb | 2022-04-19 |
| 11199778 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix | 2021-12-14 |
| 11062946 | Self-aligned contact on a semiconductor device | Ashim Dutta, Ekmini Anuja De Silva, Luciana Meli Thompson | 2021-07-13 |
| 10998191 | Graded hardmask interlayer for enhanced extreme ultraviolet performance | Ekmini Anuja De Silva, Dario L. Goldfarb | 2021-05-04 |
| 10886462 | Encapsulated memory pillars | Ashim Dutta, Ekmini Anuja De Silva, Luciana Meli Thompson | 2021-01-05 |
| 10879107 | Method of forming barrier free contact for metal interconnects | Ashim Dutta, Ekmini Anuja De Silva, Luciana Meli Thompson | 2020-12-29 |