Issued Patents All Time
Showing 601–625 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815734 | Use of gas cluster ion beam to reduce metal void formation in interconnect structures | Kangguo Cheng, Junli Wang, Keith Kwong Hon Wong | 2014-08-26 |
| 8809174 | MOSFET gate and source/drain contact metallization | Soon-Cheon Seo, Bruce B. Doris | 2014-08-19 |
| 8802558 | Copper interconnect structures and methods of making same | Marc A. Bergendahl, David V. Horak, Baozhen Li, Shom Ponoth | 2014-08-12 |
| 8802563 | Surface repair structure and process for interconnect applications | Conal E. Murray | 2014-08-12 |
| 8803321 | Dual damascene dual alignment interconnect scheme | Steven J. Holmes, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-08-12 |
| 8802559 | Interconnect structure with an electromigration and stress migration enhancement liner | Baozhen Li | 2014-08-12 |
| 8796853 | Metallic capped interconnect structure with high electromigration resistance and low resistivity | Chao-Kun Hu | 2014-08-05 |
| 8796783 | Borderless contact structure employing dual etch stop layers | Su Chen Fan, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-08-05 |
| 8796854 | Hybrid interconnect structure for performance improvement and reliability enhancement | Thomas M. Shaw, Keith Kwong Hon Wong, Haining Yang | 2014-08-05 |
| 8790989 | Modularized three-dimensional capacitor array | Louis L. Hsu, Xu Ouyang | 2014-07-29 |
| 8785320 | Structure and process for metallization in high aspect ratio features | Fenton R. McFeely | 2014-07-22 |
| 8785284 | FinFETs and fin isolation structures | Marc A. Bergendahl, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-07-22 |
| 8779491 | 3D via capacitor with a floating conductive plate for improved reliability | Fen Chen, Baozhen Li | 2014-07-15 |
| 8772156 | Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications | Louis L. Hsu, William R. Tonti | 2014-07-08 |
| 8765590 | Insulative cap for borderless self-aligning contact in semiconductor device | Kangguo Cheng, Junli Wang, Keith Kwong Hon Wong | 2014-07-01 |
| 8766360 | Insulative cap for borderless self-aligning contact in semiconductor device | Kangguo Cheng, Junli Wang, Keith Kwong Hon Wong | 2014-07-01 |
| 8765585 | Method of forming a borderless contact structure employing dual etch stop layers | Su Chen Fan, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-07-01 |
| 8754526 | Hybrid interconnect structure for performance improvement and reliability enhancement | Thomas M. Shaw, Keith Kwong Hon Wong, Haining Yang | 2014-06-17 |
| 8753927 | Low cost anti-fuse structure and method to make same | Stephen M. Gates | 2014-06-17 |
| 8753979 | Hybrid interconnect structure for performance improvement and reliability enhancement | Thomas M. Shaw, Keith Kwong Hon Wong, Haining Yang | 2014-06-17 |
| 8754483 | Low-profile local interconnect and method of making the same | Shom Ponoth, David V. Horak, Charles W. Koburger, III | 2014-06-17 |
| 8754520 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, David V. Horak, Son V. Nguyen, Shom Ponoth | 2014-06-17 |
| 8742581 | Enhanced diffusion barrier for interconnect structures | Daniel C. Edelstein, Steven E. Molis | 2014-06-03 |
| 8735279 | Air-dielectric for subtractive etch line and via metallization | David V. Horak, Elbert E. Huang, Charles W. Koburger, III, Shom Ponoth | 2014-05-27 |
| 8716101 | Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices | Kaushik Chandra, Ronald G. Filippi, Wai-Kin Li, Ping-Chuan Wang | 2014-05-06 |