Issued Patents All Time
Showing 626–650 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8716127 | Metal alloy cap integration | Marc A. Bergendahl, Steven J. Holmes, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-05-06 |
| 8703604 | Creation of vias and trenches with different depths | Shom Ponoth, David V. Horak, Takeshi Nogami | 2014-04-22 |
| 8704343 | Borderless interconnect line structure self-aligned to upper and lower level contact vias | Shom Ponoth, David V. Horak, Charles W. Koburger, III | 2014-04-22 |
| 8692375 | Interconnect structure containing various capping materials for programmable electrical fuses | Louis L. Hsu, William R. Tonti | 2014-04-08 |
| 8679970 | Structure and process for conductive contact integration | Lynne M. Gignac | 2014-03-25 |
| 8669182 | Metal cap with ultra-low κ dielectric material for circuit interconnect applications | Daniel C. Edelstein | 2014-03-11 |
| 8664766 | Interconnect structure containing non-damaged dielectric and a via gouging feature | Terry A. Spooner, Oscar van der Straten | 2014-03-04 |
| 8661664 | Techniques for forming narrow copper filled vias having improved conductivity | Fenton R. McFeely | 2014-03-04 |
| 8659156 | Interconnect structure with an electromigration and stress migration enhancement liner | Baozhen Li | 2014-02-25 |
| 8642460 | Semiconductor switching device and method of making the same | Stephen A. Cohen, Baozhen Li | 2014-02-04 |
| 8637957 | Low cost anti-fuse structure | Stephen M. Gates | 2014-01-28 |
| 8637400 | Interconnect structures and methods for back end of the line integration | David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2014-01-28 |
| 8629511 | Mask free protection of work function material portions in wide replacement gate electrodes | Charles W. Koburger, III, Marc A. Bergendahl, David V. Horak, Shom Ponoth | 2014-01-14 |
| 8624395 | Redundancy design with electro-migration immunity and method of manufacture | Louis L. Hsu, Conal E. Murray, Ping-Chuan Wang | 2014-01-07 |
| 8617984 | Tungsten metallization: structure and fabrication of same | Daniel C. Edelstein | 2013-12-31 |
| 8610276 | Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture | Kaushik Chanda, Daniel C. Edelstein | 2013-12-17 |
| 8609504 | 3D via capacitor with a floating conductive plate for improved reliability | Fen Chen, Baozhen Li | 2013-12-17 |
| 8609534 | Electrical fuse structure and method of fabricating same | David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2013-12-17 |
| 8610244 | Layered structure with fuse | Louis Lu-Chen Hsu, Jack A. Mandelman, William R. Tonti | 2013-12-17 |
| 8592306 | Redundant metal barrier structure for interconnect applications | Thomas M. Shaw | 2013-11-26 |
| 8569168 | Dual-metal self-aligned wires and vias | Steven J. Holmes, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2013-10-29 |
| 8564132 | Tungsten metallization: structure and fabrication of same | Daniel C. Edelstein | 2013-10-22 |
| 8563419 | Method of manufacturing an interconnect structure and design structure thereof | Kaushik Chanda, Daniel C. Edelstein | 2013-10-22 |
| 8558284 | Integrated circuit line with electromigration barriers | David V. Horak, Takeshi Nogami, Shom Ponoth | 2013-10-15 |
| 8558384 | Interconnect structure containing various capping materials for electrical fuse and other related applications | Louis L. Hsu, William R. Tonti | 2013-10-15 |