Issued Patents All Time
Showing 651–675 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8551874 | MOSFET gate and source/drain contact metallization | Soon-Cheon Seo, Bruce B. Doris | 2013-10-08 |
| 8546209 | Replacement metal gate processing with reduced interlevel dielectric layer etch rate | Kangguo Cheng, Junli Wang, Keith Kwong Hon Wong | 2013-10-01 |
| 8530320 | High-nitrogen content metal resistor and method of forming same | Daniel C. Edelstein | 2013-09-10 |
| 8525232 | Semiconductor structure having a wetting layer | Takeshi Nogami, Keith Kwong Hon Wong | 2013-09-03 |
| 8525339 | Hybrid copper interconnect structure and method of fabricating same | David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2013-09-03 |
| 8518773 | Method of fabricating semiconductor capacitor | David V. Horak, Shom Ponoth, Hosadurga Shobha | 2013-08-27 |
| 8497580 | Noble metal cap for interconnect structures | Daniel C. Edelstein, Fenton R. McFeely | 2013-07-30 |
| 8492274 | Metal alloy cap integration | Marc A. Bergendahl, Steven J. Holmes, David V. Horak, Charles W. Koburger, III, Shom Ponoth | 2013-07-23 |
| 8492265 | Pad bonding employing a self-aligned plated liner for adhesion enhancement | David V. Horak, Takeshi Nogami, Shom Ponoth | 2013-07-23 |
| 8492270 | Structure for nano-scale metallization and method for fabricating same | Shom Ponoth, David V. Horak, Elbert E. Huang, Sivananda K. Kanakasabapathy, Charles W. Koburger, III | 2013-07-23 |
| 8492871 | Electrical fuse and method of making | Haining Yang | 2013-07-23 |
| 8487696 | Modularized three-dimensional capacitor array | Louis L. Hsu, Xu Ouyang | 2013-07-16 |
| 8482132 | Pad bonding employing a self-aligned plated liner for adhesion enhancement | David V. Horak, Takeshi Nogami, Shom Ponoth | 2013-07-09 |
| 8476160 | Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall | Shom Ponoth, David V. Horak | 2013-07-02 |
| 8471356 | Programmable anti-fuse structures with conductive material islands | Kangguo Cheng, Louis L. Hsu, William R. Tonti | 2013-06-25 |
| 8471296 | FinFET fuse with enhanced current crowding | Kangguo Cheng, Louis C. Hsu, William R. Tonti | 2013-06-25 |
| 8456006 | Hybrid interconnect structure for performance improvement and reliability enhancement | Thomas M. Shaw, Keith Kwong Hon Wong, Haining Yang | 2013-06-04 |
| 8450204 | Structure and process for metallization in high aspect ratio features | Fenton R. McFeely | 2013-05-28 |
| 8450205 | Redundancy design with electro-migration immunity and method of manufacture | Louis L. Hsu, Conal E. Murray, Ping-Chuan Wang | 2013-05-28 |
| 8421186 | Electrically programmable metal fuse | Baozhen Li, Chunyan E. Tian | 2013-04-16 |
| 8421228 | Structure and methods of forming contact structures | Ying Li, Keith Kwong Hon Wong | 2013-04-16 |
| 8420531 | Enhanced diffusion barrier for interconnect structures | Daniel C. Edelstein, Steven E. Molis | 2013-04-16 |
| 8420537 | Stress locking layer for reliable metallization | Kaushik Chanda, Ronald G. Filippi, Charles C. Goldsmith, Ping-Chuan Wang | 2013-04-16 |
| 8404582 | Structure and method for manufacturing interconnect structures having self-aligned dielectric caps | David V. Horak, Takeshi Nogami, Shom Ponoth | 2013-03-26 |
| 8405135 | 3D via capacitor with a floating conductive plate for improved reliability | Fen Chen, Baozhen Li | 2013-03-26 |