Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7066800 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +4 more | 2006-06-27 |
| 7060606 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2006-06-13 |
| 7029365 | Pad assembly for electrochemical mechanical processing | Shou-Sung Chang, Donald Olgado, Liang-Yuh Chen, Alain Duboust, Ralph Wadensweiler | 2006-04-18 |
| 7022608 | Method and composition for the removal of residual materials during substrate planarization | Lizhong Sun, Shijian Li | 2006-04-04 |
| 7012025 | Tantalum removal during chemical mechanical polishing | Lizhong Sun, Shijian Li, Feng Q. Liu | 2006-03-14 |
| 7008554 | Dual reduced agents for barrier removal in chemical mechanical polishing | Shijian Li, Feng Q. Liu, Lizhong Sun, Liang-Yuh Chen | 2006-03-07 |
| 6991526 | Control of removal profile in electrochemically assisted CMP | Lizhong Sun, Liang-Yuh Chen, Siew Neo, Feng Q. Liu, Alain Duboust +1 more | 2006-01-31 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2006-01-31 |
| 6988942 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +4 more | 2006-01-24 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6869498 | Chemical mechanical polishing with shear force measurement | Rashid Mavliev, Liang-Yuh Chen | 2005-03-22 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Siew Neo, Liang-Yuh Chen | 2005-03-08 |
| 6863794 | Method and apparatus for forming metal layers | Shijian Li | 2005-03-08 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Lizhong Sun, Shijian Li, Fred C. Redeker | 2005-02-22 |
| 6821881 | Method for chemical mechanical polishing of semiconductor substrates | Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2004-11-23 |
| 6739951 | Method and apparatus for electrochemical-mechanical planarization | Lizhong Sun, Fred C. Redeker | 2004-05-25 |
| 6709316 | Method and apparatus for two-step barrier layer polishing | Lizhong Sun, Shijian Li | 2004-03-23 |
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker +1 more | 2003-12-30 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Lizhong Sun, Shijian Li, John M. White | 2003-11-25 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-10-28 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-10-14 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Shijian Li, Lizhong Sun | 2003-09-02 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Yuchun Wang, Doyle E. Bennett, Fred C. Redeker, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-05-13 |
| 6541384 | Method of initiating cooper CMP process | Lizhong Sun, Shijian Li, John M. White | 2003-04-01 |