Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-03-25 |
| 6524167 | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization | Lizhong Sun, Shijian Li | 2003-02-25 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-01-14 |
| 6379223 | Method and apparatus for electrochemical-mechanical planarization | Lizhong Sun, Fred C. Redeker | 2002-04-30 |
| 6309276 | Endpoint monitoring with polishing rate change | Fred C. Redeker, Kapila Wijekoon | 2001-10-30 |
| 6299741 | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus | Lizhong Sun, Fritz Redeker | 2001-10-09 |