Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7390744 | Method and composition for polishing a substrate | Renhe Jia, Feng Q. Liu, Liang-Yuh Chen | 2008-06-24 |
| 7384534 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Siew Neo, Liang-Yuh Chen | 2008-06-10 |
| 7374644 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev +2 more | 2008-05-20 |
| 7375023 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2008-05-20 |
| 7344431 | Pad assembly for electrochemical mechanical processing | Yongqi Hu, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen | 2008-03-18 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +9 more | 2008-03-18 |
| 7323416 | Method and composition for polishing a substrate | Feng Q. Liu, Tianbao Du, Alain Duboust, Yan Wang, Yongqi Hu +3 more | 2008-01-29 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +4 more | 2007-12-25 |
| 7303662 | Contacts for electrochemical processing | Rashid Mavliev, Yongqi Hu, Paul D. Butterfield, Antoine P. Manens, Liang-Yuh Chen | 2007-12-04 |
| 7285036 | Pad assembly for electrochemical mechanical polishing | Shou-Sung Chang, Donald Olgado, Liang-Yuh Chen, Alain Duboust, Ralph Wadensweiler | 2007-10-23 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2007-10-09 |
| 7232514 | Method and composition for polishing a substrate | Feng Q. Liu, Yongqi Hu, Siew Neo, Yan Wang, Alain Duboust +1 more | 2007-06-19 |
| 7232363 | Polishing solution retainer | Hanzhong Zhang, Feng Q. Liu, Rashid Mavliev, Donald Olgado, Liang-Yuh Chen | 2007-06-19 |
| 7210988 | Method and apparatus for reduced wear polishing pad conditioning | Yan Wang, Yongqi Hu, Feng Q. Liu, Liang-Yuh Chen, Daxin Mao +4 more | 2007-05-01 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2007-04-24 |
| 7160432 | Method and composition for polishing a substrate | Feng Q. Liu, Liang-Yuh Chen, Alain Duboust, Siew Neo, Yongqi Hu +2 more | 2007-01-09 |
| 7153188 | Temperature control in a chemical mechanical polishing system | Steven M. Zuniga, Hung Chih Chen, Kapila Wijekoon, Fred C. Redeker, Rajeev Bajaj | 2006-12-26 |
| 7137879 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +4 more | 2006-11-21 |
| 7137868 | Pad assembly for electrochemical mechanical processing | Shou-Sung Chang, Donald Olgado, Liang-Yuh Chen, Alain Duboust, Ralph Wadensweiler | 2006-11-21 |
| 7128825 | Method and composition for polishing a substrate | Feng Q. Liu, Yongqi Hu, Siew Neo, Yan Wang, Alain Duboust +1 more | 2006-10-31 |
| 7125477 | Contacts for electrochemical processing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev | 2006-10-24 |
| 7104869 | Barrier removal at low polish pressure | Rashid Mavliev, Lizhong Sun, Feng Q. Liu, Liang-Yuh Chen, Ratson Morad | 2006-09-12 |
| 7084064 | Full sequence metal and barrier layer electrochemical mechanical processing | Feng Q. Liu, Liang-Yuh Chen, Yongqi Hu | 2006-08-01 |
| 7077725 | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus | Lizhong Sun, Fritz Redeker | 2006-07-18 |
| 7077721 | Pad assembly for electrochemical mechanical processing | Yongqi Hu, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen | 2006-07-18 |