Issued Patents All Time
Showing 51–75 of 96 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6490146 | Electrostatic chuck bonded to base with a bond layer and method | You Wang, Shamouil Shamouilian, Arnold Kholodenko, Alexander Veytser, Surinder Bedi +4 more | 2002-12-03 |
| 6490144 | Support for supporting a substrate in a process chamber | Kadthala Ramaya Narendrnath, Syed H. Askari, Dennis S. Grimard, Surinder Bedi, Shamouil Shamouilian | 2002-12-03 |
| 6462928 | Electrostatic chuck having improved electrical connector and method | Shamouil Shamouilian, You Wang, Surinder Bedi, Arnold Kholodenko, Alexander Veytser +4 more | 2002-10-08 |
| 6440221 | Process chamber having improved temperature control | Shamouil Shamouilian, Kadthala Ramaya Narendrnath, Eric Askarinam, Edwin C. Weldon, Michael R. Rice +1 more | 2002-08-27 |
| 6414834 | Dielectric covered electrostatic chuck | Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan +8 more | 2002-07-02 |
| 6370006 | Electrostatic chuck having a plurality of gas inlet channels | Kadthala Ramaya Narendrnath, Shamouil Shamouilian | 2002-04-09 |
| 6310755 | Electrostatic chuck having gas cavity and method | Arnold Kholodenko, Shamouil Shamouilian, You Wang, Wing Cheng, Alexander Veytser +4 more | 2001-10-30 |
| 6280584 | Compliant bond structure for joining ceramic to metal | Kadthala Ramaya Narendrnath, Shamouil Shamouilian | 2001-08-28 |
| 6273958 | Substrate support for plasma processing | Shamouil Shamouilian, Siamak Salimian, Mahmoud Dahimene, Michael G. Chafin, Dennis S. Grimard | 2001-08-14 |
| 6267839 | Electrostatic chuck with improved RF power distribution | Shamouil Shamouilian, Arnold Kholodenko | 2001-07-31 |
| 6220607 | Thermally conductive conformal media | Gerhard Schneider, Edwin C. Weldon, Kadthala Ramaya Narendrnath | 2001-04-24 |
| 6217655 | Stand-off pad for supporting a wafer on a substrate support chuck | Shamouil Shamouilian, Hyman J. Levinstein, Vijay D. Parkhe | 2001-04-17 |
| 6151203 | Connectors for an electrostatic chuck and combination thereof | Shamouil Shamouilian, Arnold Kholodenko, Dennis S. Grimard, Liang Wang, Gerhard Schneider +4 more | 2000-11-21 |
| 6108189 | Electrostatic chuck having improved gas conduits | Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan +8 more | 2000-08-22 |
| 6095084 | High density plasma process chamber | Shamouil Shamouilian, Arnold Kholodenko, Dennis S. Grimard, Jonathan D. Mohn, Michael G. Chafin +1 more | 2000-08-01 |
| 6017642 | Low dielectric loss glasses | Barry Jay Thaler, Ashok N. Prabhu, Ellen S. Tormey | 2000-01-25 |
| 5958807 | Low dielectric loss glass ceramic compositions | Barry Jay Thaler, Ashok N. Prabhu, Ellen S. Tormey | 1999-09-28 |
| 5880924 | Electrostatic chuck capable of rapidly dechucking a substrate | Shamouil Shamouilian | 1999-03-09 |
| 5876536 | Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate | Barry Jay Thaler, Ashok N. Prabhu | 1999-03-02 |
| 5847935 | Electronic circuit chip package | Barry Jay Thaler, Ashok N. Prabhu, Bernard D. Geller | 1998-12-08 |
| 5751537 | Multielectrode electrostatic chuck with fuses | Shamouil Shamouilian | 1998-05-12 |
| 5681444 | Electrical feedthroughs for ceramic circuit board support substrates | Thomas Peter Azzaro, Barry Jay Thaler, Edward J. Conlon | 1997-10-28 |
| 5653834 | Process for making electrical feedthroughs for ceramic circuit board support substrates | Thomas Peter Azzaro, Barry Jay Thaler, Edward J. Conlon | 1997-08-05 |
| 5565262 | Electrical feedthroughs for ceramic circuit board support substrates | Thomas Peter Azzaro, Barry Jay Thaler, Edward J. Conlon | 1996-10-15 |
| 5514451 | Conductive via fill inks for ceramic multilayer circuit boards on support substrates | Barry Jay Thaler, Ashok N. Prabhu, Ellen S. Tormey | 1996-05-07 |