BT

Barry Jay Thaler

SA Sarnoff: 11 patents #35 of 471Top 8%
LC Lamina Ceramics: 8 patents #2 of 19Top 15%
DC David Sarnoff Research Center: 6 patents #10 of 125Top 8%
RC Rca: 2 patents #592 of 1,739Top 35%
GE: 2 patents #13,562 of 36,430Top 40%
TL Thomson Licensing: 1 patents #1,365 of 2,575Top 55%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #125,999 of 4,157,543Top 4%
30
Patents All Time

Issued Patents All Time

Showing 25 most recent of 30 patents

Patent #TitleCo-InventorsDate
7183640 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards Joseph Mazzochette, Ellen S. Tormey 2007-02-27
7011725 High performance embedded RF filters Bernard D. Geller, Aly E. Fathy, Michael Liberatore, Attiganal N. Sreeram 2006-03-14
6914501 High performance embedded RF filters Bernard D. Geller, Michael Liberatore, Attiganal N. Sreeram, Aly E. Fathy 2005-07-05
6739047 Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate Mark S. Hammond, Ellen S. Tormey, Leszek Hozer, Hung-Tse Chen, Bernard D. Geller +1 more 2004-05-25
6713862 Low temperature co-fired ceramic-metal packaging technology Ponnuswamy Palanisamy, Attiganal Narayanaswamysreeram, Ellen S. Tormey, John Connolly, Ramon Ubaldo Martinelli +3 more 2004-03-30
6709749 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate Ananda H. Kumar, Ashok N. Prabhu 2004-03-23
6690123 Electron gun with resistor and capacitor George Herbert Needham Riddle, Roger C. Alig, Aly E. Fathy, Attiganal Narayanaswamy Sreeram, Michael Liberatore 2004-02-10
6653009 Solid oxide fuel cells and interconnectors Conghua Wang, Ponnusamy Palanisamy, Mark S. Hammond 2003-11-25
6628057 Slightly conducting insulators for cathode-ray tube (CRT) applications Philip M. Heyman, Robert L. Quinn, Richard Quinn, Liyou Yang 2003-09-30
6518502 Ceramic multilayer circuit boards mounted on a patterned metal support substrate Mark S. Hammond, Ellen S. Tormey, Leszek Hozer, Hung-Tse Chen, Bernard D. Geller +1 more 2003-02-11
6471805 Method of forming metal contact pads on a metal support substrate Ashok N. Prabhu 2002-10-29
6455930 Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology Ponnuswamy Palanisamy, Attiganal Narayanaswamy Sreeram, Ellen S. Tormey, John Connolly, Ramon Ubaldo Martinelli +2 more 2002-09-24
6300267 High dielectric constant buried capacitors with extended operating temperature ranges Hung-Tse Chen 2001-10-09
6017642 Low dielectric loss glasses Ananda H. Kumar, Ashok N. Prabhu, Ellen S. Tormey 2000-01-25
5958807 Low dielectric loss glass ceramic compositions Ananda H. Kumar, Ashok N. Prabhu, Ellen S. Tormey 1999-09-28
5876536 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate Ananda H. Kumar, Ashok N. Prabhu 1999-03-02
5858145 Method to control cavity dimensions of fired multilayer circuit boards on a support Attinganal Narayanaswamy Sreeram, Ashok N. Prabhu 1999-01-12
5846396 Liquid distribution system Peter John Zanzucchi, Satyam Choudary Cherukuri, Sterling Edward McBride, Robert R. Demers, Aaron W. Levine +6 more 1998-12-08
5847935 Electronic circuit chip package Ashok N. Prabhu, Ananda H. Kumar, Bernard D. Geller 1998-12-08
5842106 Method of producing micro-electrical conduits Robert L. Quinn, Paul Leonard Braun, Peter John Zanzucchi, Charlotte Anna Burton, Sterling Edward McBride +1 more 1998-11-24
5681444 Electrical feedthroughs for ceramic circuit board support substrates Thomas Peter Azzaro, Edward J. Conlon, Ananda H. Kumar 1997-10-28
5653834 Process for making electrical feedthroughs for ceramic circuit board support substrates Thomas Peter Azzaro, Edward J. Conlon, Ananda H. Kumar 1997-08-05
5581876 Method of adhering green tape to a metal support substrate with a bonding glass Ashok N. Prabhu 1996-12-10
5565262 Electrical feedthroughs for ceramic circuit board support substrates Thomas Peter Azzaro, Edward J. Conlon, Ananda H. Kumar 1996-10-15
5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates Ananda H. Kumar, Ashok N. Prabhu, Ellen S. Tormey 1996-05-07