AK

Ananda H. Kumar

Applied Materials: 24 patents #504 of 7,310Top 7%
IBM: 21 patents #5,175 of 70,183Top 8%
MI Microfabrica: 9 patents #15 of 48Top 35%
BE Bloom Energy: 7 patents #46 of 315Top 15%
UC University Of Southern California: 6 patents #114 of 1,826Top 7%
The Johns Hopkins University: 5 patents #372 of 4,416Top 9%
SA Sarnoff: 4 patents #120 of 471Top 30%
DC David Sarnoff Research Center: 4 patents #18 of 125Top 15%
CI Crystal Solar, Incorporated: 3 patents #8 of 13Top 65%
LC Lamina Ceramics: 1 patents #17 of 19Top 90%
📍 Fremont, CA: #78 of 9,298 inventorsTop 1%
🗺 California: #2,419 of 386,348 inventorsTop 1%
Overall (All Time): #15,795 of 4,157,543Top 1%
96
Patents All Time

Issued Patents All Time

Showing 76–96 of 96 patents

Patent #TitleCo-InventorsDate
5436412 Interconnect structure having improved metallization Umar M. Ahmad, Eric D. Perfecto, Chandrika Prasad, Sampath Purushothaman, Sudipta K. Ray 1995-07-25
5266446 Method of making a multilayer thin film structure Kenneth Chang, George Czornyj, Mukta S. Farooq, Marvin S. Pitler, Heinz O. Steimel 1993-11-30
5219669 Layer thin film wiring process featuring self-alignment of vias Kenneth Chang, George Czornyj, Heinz O. Steimel 1993-06-15
5215610 Method for fabricating superconductor packages Nunzio DiPaolo, Lovell B. Wiggins 1993-06-01
5209817 Selective plating method for forming integral via and wiring layers Umar M. Ahmad, Daniel G. Berger, Susan J. LaMaire, Keshav Prasad, Sudipta K. Ray +1 more 1993-05-11
5196251 Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate Nanik Bakhru, Richard A. Bates, George Czornyj, Nunzio DiPaolo, Suryanarayana Mukkavilli +2 more 1993-03-23
5139975 Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates Lester W. Herron, Sarah H. Knickerbocker, Govindarajan Natarajan, Srinivasa S. N. Reddy 1992-08-18
5130229 Multi layer thin film wiring process featuring self-alignment of vias Kenneth Chang, George Czornyj, Heinz O. Steimel 1992-07-14
4971738 Enhanced removal of carbon from ceramic substrate laminates Lester W. Herron, Sarah H. Knickerbocker, Govindarajan Natarajan, Srinivasa S. N. Reddy 1990-11-20
4786674 Diffusion isolation layer for maskless cladding process Lester W. Herron, Robert W. Nufer 1988-11-22
4704304 Method for repair of opens in thin film lines on a substrate Albert Amendola, Thomas R. Vance 1987-11-03
4627160 Method for removal of carbonaceous residues from ceramic structures having internal metallurgy Lester W. Herron, Raj N. Master, Robert W. Nufer 1986-12-09
4582722 Diffusion isolation layer for maskless cladding process Lester W. Herron, Robert W. Nufer 1986-04-15
4510000 Method for palladium activating molybdenum metallized features on a ceramic substrate Bernard Schwartz 1985-04-09
4504322 Re-work method for removing extraneous metal from cermic substrates Avinash S. Adwalpalker, Renee L. Weisman 1985-03-12
4501768 Thin film floating zone metal coating technique 1985-02-26
4493856 Selective coating of metallurgical features of a dielectric substrate with diverse metals Kris V. Srikrishnan 1985-01-15
4442137 Maskless coating of metallurgical features of a dielectric substrate 1984-04-10
4413061 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper Peter W. McMillan, Rao R. Tummala 1983-11-01
4340618 Process for forming refractory metal layers on ceramic substrate Michael Fury 1982-07-20
4301324 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper Peter W. McMillan, Rao R. Tummala 1981-11-17