Issued Patents All Time
Showing 76–97 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Tongbi Jiang | 2017-02-21 |
| 9570367 | Ultra fine pitch PoP coreless package | Jun Chung Hsu | 2017-02-14 |
| 9559081 | Independent 3D stacking | Kwan-Yu Lai, Kunzhong Hu | 2017-01-31 |
| 9548288 | Integrated circuit die decoupling system with reduced inductance | Vidhya Ramachandran, Chonghua Zhong, Shawn Searles, Young Doo Jeon, Huabo Chen | 2017-01-17 |
| 9442025 | System and method for calibrating temperatures sensor for integrated circuits | Yizhang Yang | 2016-09-13 |
| 9331058 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2016-05-03 |
| 9318474 | Thermally enhanced wafer level fan-out POP package | Yizhang Yang, Mengzhi Pang | 2016-04-19 |
| 9305853 | Ultra fine pitch PoP coreless package | Jun Chung Hsu | 2016-04-05 |
| 9305959 | Biometric sensor chip having distributed sensor and control circuitry | Milind S. Bhagavat | 2016-04-05 |
| 9263426 | PoP structure with electrically insulating material between packages | Jie Zhao, Yizhang Yang, Chih-Ming Chung | 2016-02-16 |
| 9236355 | EMI shielded wafer level fan-out pop package | Mengzhi Pang, Se Young Yang, Leland W. Lew | 2016-01-12 |
| 8963311 | PoP structure with electrically insulating material between packages | Jie Zhao, Yizhang Yang, Chih-Ming Chung | 2015-02-24 |
| 8723321 | Copper interconnects with improved electromigration lifetime | Christy Mei-Chu Woo, Paul R. Besser, Kok Yong Yiang, Richard C. Blish, II, Christine Hau-Riege | 2014-05-13 |
| 8629541 | Semiconductor package for controlling warpage | Min-Shin Ou, Chun-Yang Lee | 2014-01-14 |
| 8486767 | Interconnects with improved electromigration reliability | Fei Wang | 2013-07-16 |
| 8405187 | Chip package with channel stiffener frame | Eric Tosaya, Chia-Ken Leong, Tom Ley | 2013-03-26 |
| 8008133 | Chip package with channel stiffener frame | Eric Tosaya, Chia-Ken Leong, Tom Ley | 2011-08-30 |
| 7989956 | Interconnects with improved electromigration reliability | Fei Wang | 2011-08-02 |
| 7923850 | Semiconductor chip with solder joint protection ring | Mohammad Khan, Ranjit Gannamani, Raj N. Master | 2011-04-12 |
| 7745264 | Semiconductor chip with stratified underfill | Ranjit Gannamani, Srinivasan Parthasarathy | 2010-06-29 |
| 7679200 | Semiconductor chip with crack stop | Michael Z. Su, Jaime Bravo, Lei Fu | 2010-03-16 |
| 7253504 | Integrated circuit package and method | Jinsu Kwon, Richard C. Blish, II | 2007-08-07 |